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參數(shù)資料
| 型號(hào)： | AD9229ABCPZRL7-65 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 16/40頁 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT SRL 65MSPS 48LFCSP |
| 標(biāo)準(zhǔn)包裝： | 750 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 65M |
| 數(shù)據(jù)接口： | 串行 |
| 轉(zhuǎn)換器數(shù)目： | 4 |
| 功率耗散（最大）： | 1.47W |
| 電壓電源： | 模擬和數(shù)字 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 48-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 48-LFCSP-VQ（7x7） |
| 包裝： | 帶卷 (TR) |
| 輸入數(shù)目和類型： | 8 個(gè)單端，單極；4 個(gè)差分，單極 |
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AD9229
Rev. B | Page 23 of 40
Exposed Paddle Thermal Heat Slug Recommendations
SILKSCREEN PARTITION
PIN 1 INDICATOR
04418-
052
It is mandatory that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9229. A
continuous exposed copper plane on the PCB should mate to
the AD9229 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be solder or epoxy filled (plugged).
Figure 46. Typical PCB Layout
To maximize the solder coverage and adhesion between the
ADC and PCB, overlay a silkscreen to partition the continuous
copper plane on the PCB into several uniform sections. This
provides several tie points between the two during the reflow
process. Using one continuous plane with no silkscreen
partitions only guarantees one tie point between the ADC and
PCB. See Figure 46 for a PCB layout example. For detailed
information on packaging and the PCB layout of chip scale
packages, visit www.analog.com.
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