參數(shù)資料
型號(hào): AD8197BASTZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 24/28頁(yè)
文件大?。?/td> 0K
描述: IC SWITCH DVI/HDMI 4:1 100-LQFP
標(biāo)準(zhǔn)包裝: 1
功能: 開(kāi)關(guān)
電路: 1 x 16:1
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 100-LQFP
供應(yīng)商設(shè)備封裝: 100-LQFP(14x14)
包裝: 托盤(pán)
AD8197B
Rev. 0 | Page 5 of 28
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
AVCC to AVEE
3.7 V
DVCC to DVEE
3.7 V
DVEE to AVEE
±0.3 V
VTTI
AVCC + 0.6 V
VTTO
AVCC + 0.6 V
AMUXVCC
5.5 V
Internal Power Dissipation
2.2 W
High Speed Input Voltage
AVCC 1.4 V < VIN <
AVCC + 0.6 V
High Speed Differential Input Voltage
2.0 V
Low Speed Input Voltage
DVEE 0.3 V < VIN <
AMUXVCC + 0.6 V
I2C and Parallel Logic Input Voltage
DVEE 0.3 V < VIN <
DVCC + 0.6 V
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions: a device soldered
in a 4-layer JEDEC circuit board for surface-mount packages.
θJC is specified for no airflow.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
100-Lead LQFP
56
19
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8197B
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure. To ensure proper operation, it
is necessary to observe the maximum power rating as determined
by the coefficients in Table 3.
ESD CAUTION
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