參數(shù)資料
型號: AD8001
廠商: Analog Devices, Inc.
英文描述: Current Feedback Amplifier(800MHz,50mW電流反饋放大器)
中文描述: 電流反饋放大器(800MHz的,50mW的電流反饋放大器)
文件頁數(shù): 3/16頁
文件大小: 372K
代理商: AD8001
AD8001
REV. B
–3–
ABSOLUT E MAX IMUM RAT INGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation
2
Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Watts
Small OutlinePackage (R) . . . . . . . . . . . . . . . . . . . 0.9 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .
±
1.2 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage T emperature Range N, R . . . . . . . . .–65
°
C to +125
°
C
Operating T emperature Range (A Grade) . . . –40
°
C to +85
°
C
Lead T emperature Range (Soldering 10 sec) . . . . . . . . +300
°
C
NOT ES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. T his is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Pin Plastic Package:
θ
JA
= 90
°
C/Watt
8-Pin SOIC Package:
θ
JA
= 140
°
C/Watt
MAX IMUM POWE R DISSIPAT ION
T he maximum power that can be safely dissipated by the
AD8001 is limited by the associated rise in junction tempera-
ture. T he maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately +150
°
C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175
°
C for an extended
period can result in device failure.
While the AD8001 is internally short circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (+150
°
C) is not exceeded under all conditions. T o
ensure proper operation, it is necessary to observe the maximum
power derating curves.
2.0
0
–50
80
1.5
0.5
–40
1.0
0
10
–10
AMBIENT TEMPERATURE –
°
C
–20
–30
20 30 40 50 60 70
90
M
T
J
= +150
°
C
8-PIN MINI-DIP PACKAGE
8-PIN SOIC PACKAGE
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature
ME T ALLIZAT ION PHOT O
Dimensions shown in inches and (mm).
C onnect Substrate to –V
S
.
ORDE RING GUIDE
T emperature
Range
Package
Description
Package
Option
Model
AD8001AN
AD8001AR
AD8001ACHIPS
AD8001SMD
1
AD8001R-EB+2
2
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
8-Pin Plastic DIP
8-Pin Plastic SOIC
Die Form
8-Pin Cerdip
SOIC Eval Board,
G = +2
N-8
SO-8
Q-8
NOT ES
1
Standard Military Drawing Device. Ordering Number T BD. Contact our local
sales office, representative or distributor for availability.
2
Refer to Evaluation Board section.
WARNING!
ESD SENSITIVE DEVICE
C AUT ION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8001 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. T herefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
2
–IN
3
+IN
+V
S
7
+V
S
7
4 –V
S
4
–V
S
6 OUT
NC
0.038
(0.96)
0.041 (1.05)
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