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參數資料
| 型號： | AD8000YCPZ-R2 |
| 廠商： | Analog Devices Inc |
| 文件頁數： | 8/21頁 |
| 文件大小： | 0K |
| 描述： | IC OPAMP CF LN 100MA 8SFCSP |
| 產品培訓模塊： | Practical Guide High Speed PCB Layout |
| 標準包裝： | 1 |
| 放大器類型： | 電流反饋 |
| 電路數： | 1 |
| 轉換速率： | 4100 V/µs |
| -3db帶寬： | 1.35GHz |
| 電流 - 輸入偏壓： | 5µA |
| 電壓 - 輸入偏移： | 1000µV |
| 電流 - 電源： | 13.5mA |
| 電流 - 輸出 / 通道： | 100mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 12 V，±2.25 V ~ 6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-VFDFN 裸露焊盤，CSP |
| 供應商設備封裝： | 8-LFCSP-VD（3x3） |
| 包裝： | 剪切帶 (CT) |
| 其它名稱： | AD8000YCPZ-R2CT |
Data Sheet
AD8000
Rev. B | Page 15 of 20
LOW DISTORTION PINOUT
The AD8000 LFCSP features ADI’s new low distortion pinout.
The new pinout lowers the second harmonic distortion and
simplifies the circuit layout. The close proximity of the non-
inverting input and the negative supply pin creates a source of
second harmonic distortion. Physical separation of the non-
inverting input pin and the negative power supply pin reduces
this distortion significantly, as seen in Figure 22.
By providing an additional output pin, the feedback resistor
can be connected directly across Pin 2 and Pin 3. This greatly
simplifies the routing of the feedback resistor and allows a more
compact circuit layout, which reduces its size and helps to min-
imize parasitics and increase stability.
The SOIC also features a dedicated feedback pin. The feedback
pin is brought out on Pin 1, which is typically a No Connect on
standard SOIC pinouts.
Existing applications that use the standard SOIC pinout can
take full advantage of the performance offered by the AD8000.
For drop-in replacements, ensure that Pin 1 is not connected to
ground or to any other potential because this pin is connected
internally to the output of the amplifier. For existing designs,
Pin 6 can still be used for the feedback resistor.
EXPOSED PADDLE
The AD8000 features an exposed paddle, which can lower the
thermal resistance by 25% compared to a standard SOIC plastic
package. The paddle can be soldered directly to the ground plane
of the board. Figure 53 shows a typical pad geometry for the
LFCSP, the same type of pad geometry can be applied to the
SOIC package.
Thermal vias or “heat pipes” can also be incorporated into the
design of the mounting pad for the exposed paddle. These addi-
tional vias improve the thermal transfer from the package to
the PCB. Using a heavier weight copper on the surface to which
the amplifier’s exposed paddle is soldered also reduces the over-
all thermal resistance “seen” by the AD8000.
05321-034
Figure 53. LFCSP Exposed Paddle Layout
PRINTED CIRCUIT BOARD LAYOUT
Laying out the printed circuit board (PCB) is usually the last
step in the design process and often proves to be one of the
most critical. A brilliant design can be rendered useless because
of a poor or sloppy layout. Since the AD8000 can operate into
the RF frequency spectrum, high frequency board layout con-
siderations must be taken into account. The PCB layout, signal
routing, power supply bypassing, and grounding all must be
addressed to ensure optimal performance.
SIGNAL ROUTING
The AD8000 LFCSP features the new low distortion pinout
with a dedicated feedback pin and allows a compact layout. The
dedicated feedback pin reduces the distance from the output to
the inverting input, which greatly simplifies the routing of the
feedback network.
To minimize parasitic inductances, ground planes should be
used under high frequency signal traces. However, the ground
plane should be removed from under the input and output pins
to minimize the formation of parasitic capacitors, which
degrades phase margin. Signals that are susceptible to noise
pickup should be run on the internal layers of the PCB, which
can provide maximum shielding.
POWER SUPPLY BYPASSING
Power supply bypassing is a critical aspect of the PCB design
process. For best performance, the AD8000 power supply pins
need to be properly bypassed.
A parallel connection of capacitors from each of the power
supply pins to ground works best. Paralleling different values
and sizes of capacitors helps to ensure that the power supply
pins “see” a low ac impedance across a wide band of frequen-
cies. This is important for minimizing the coupling of noise into
the amplifier. Starting directly at the power supply pins, the
smallest value and sized component should be placed on the
same side of the board as the amplifier, and as close as possible
to the
amplifier, and connected to the ground plane. This process
should be repeated for the next larger value capacitor. It is
recommended for the AD8000 that a 0.1 F ceramic 0508 case
be used. The 0508 offers low series inductance and excellent
high frequency performance. The 0.1 F case provides low
impedance at high frequencies. A 10 F electrolytic capacitor
should be placed in parallel with the 0.1 F. The 10 f capacitor
provides low ac impedance at low frequencies. Smaller values
of electrolytic capacitors can be used, depending on the circuit
requirements. Additional smaller value capacitors help to
provide a low impedance path for unwanted noise out to higher
frequencies but are not always necessary.
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相關代理商/技術參數 |
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| AD8000YCPZ-REEL | 功能描述:IC OPAMP CF LN 100MA 8SFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:- 放大器類型:通用 電路數:2 輸出類型:滿擺幅 轉換速率:1.8 V/µs 增益帶寬積:6.5MHz -3db帶寬:4.5MHz 電流 - 輸入偏壓:5nA 電壓 - 輸入偏移:100µV 電流 - 電源:65µA 電流 - 輸出 / 通道:35mA 電壓 - 電源，單路/雙路(±):1.8 V ~ 5.25 V，±0.9 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:10-MSOP 包裝:管件 |
| AD8000YCPZ-REEL7 | 功能描述:IC OPAMP CF LN 100MA 8SFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產品培訓模塊:Differential Circuit Design Techniques for Communication Applications 標準包裝:1 系列:- 放大器類型:RF/IF 差分 電路數:1 輸出類型:差分 轉換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤，CSP 供應商設備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
| AD8000YRD-EBZ | 功能描述:BOARD EVAL FOR AD8000YRD RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 運算放大器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- |
| AD8000YRD-EBZ | 制造商:Analog Devices 功能描述:AD8000YRD-EBZ"A00973"EB-O8REDF-1Z |
| AD8000YRDZ | 功能描述:IC OPAMP CF LN 100MA 8SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產品培訓模塊:Differential Circuit Design Techniques for Communication Applications 標準包裝:1 系列:- 放大器類型:RF/IF 差分 電路數:1 輸出類型:差分 轉換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤，CSP 供應商設備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
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