AD7843
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
+VCC to GND
0.3 V to +7 V
Analog Input Voltage to GND
0.3 V to VCC + 0.3 V
Digital Input Voltage to GND
0.3 V to VCC + 0.3 V
Digital Output Voltage to GND
0.3 V to VCC + 0.3 V
VREF to GND
0.3 V to VCC + 0.3 V
Input Current to Any Pin Except Supplies1
±10 mA
Operating Temperature Range
Commercial
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
QSOP, TSSOP Package, Power Dissipation
450 mW
θJA Thermal Impedance
149.97°C/W (QSOP)
150.4°C/W (TSSOP)
θJC Thermal Impedance
38.8°C/W (QSOP)
27.6°C/W (TSSOP)
IR Reflow Soldering
Peak Temperture
Time-to-Peak Temperture
Ramp-Down Rate
220°C (±5°C)
10 sec to 30 sec
6°C/sec max
Pb-free parts only
Peak Temperture
250°C
Time-to-Peak Temperture
Ramp-Up Rate
Ramp-Down Rate
20 sec to 40 sec
3°C/sec max
6°C/sec max
________________
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Rating
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.