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參數(shù)資料
| 型號： | AD7841BSZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 8/13頁 |
| 文件大小： | 0K |
| 描述： | IC DAC 14BIT OCTAL VOUT 44-MQFP |
| 產(chǎn)品培訓模塊： | Data Converter Fundamentals DAC Architectures |
| 標準包裝： | 800 |
| 設置時間： | 31µs |
| 位數(shù)： | 14 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 8 |
| 電壓電源： | 模擬和數(shù)字，雙 ± |
| 功率耗散（最大）： | 303mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 44-QFP |
| 供應商設備封裝： | 44-MQFP（10x10） |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 8 電壓，單極；8 電壓，雙極 |
| 采樣率（每秒）： | 32k |
| 配用： | EVAL-AD7841EBZ-ND - BOARD EVAL FOR AD7841 |
AD7841
–4–
ABSOLUTE MAXIMUM RATINGS
1, 2
(TA = 25
°C unless otherwise noted)
VCC to GND
3
. . . . . . . . . . . . . . –0.3 V, +7 V or VDD + 0.3 V
(Whichever Is Lower)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V
Digital Inputs to GND . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V
VREF(+) to VREF(–) . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V
VREF(+) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
VREF(–) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
DUTGND to GND . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
VOUT (A–H) to GND . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . .
–40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
MQFP Package
Power Dissipation . . . . . . . . . . . . . . . . . (TJ Max – TA)/
θJA
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95°C/W
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
3V
CC must not exceed VDD by more than 0.3 V. If it is possible for this to happen
during power supply sequencing, the following diode protection scheme will ensure
protection.
PIN CONFIGURATION
3
4
5
6
7
1
2
10
11
8
9
40
39
38
41
42
43
44
36
35
34
37
PIN 1
IDENTIFIER
TOP VIEW
(Not to Scale)
12
13
14
15
16
17
18
19
20
21
22
29
30
31
32
33
27
28
25
26
23
24
DUTGND_GH
VOUTH
VREF(–)GH
VREF(+)GH
CLR
DB13
DB12
AD7841
DUTGND_AB
VOUTA
VREF(–)AB
VREF(+)AB
VDD
VSS
LDAC
A2
A1
A0
CS
DB11
DB10
DB9
DB8
DB4
V
OUT
B
V
OUT
C
DUTGND_CD
V
OUT
D
V
DD
V
OUT
E
DUTGND_EF
V
OUT
F
V
OUT
G
DB7
DB5
DB6
DB2
WR
V
CC
GND
DB0
DB1
DB3
V
REF
(–
)CDEF
V
REF
(+)CDEF
VDD
VCC
AD7841
HP5082-2811
VDD
VCC
IN4148
REV. B
Lead Temperature ............................JEDEC Industry Standard
Soldering ......................................................................J-STD-020
ESD .................................................................................. >4000 V
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