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AD7827
–4–
REV. 0
WARNNG
ESD SENSITIVE DEVICE
C AUT ION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7827 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. T herefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
PIN FUNCT ION DE SCRIPT IONS
Pin No.
Mnemonic
Description
1
CONVST
Convert Start. Puts the track-and-
hold into hold mode and initiates a
conversion.
T he state of this pin at the end of
conversion also determines whether
or not the part is powered down.
Analog Input is applied here.
Receive Frame Sync. T his is an
output. When this signal goes logic
high at the end of a conversion, the
DSP starts latching in data on the
next cycle of SCLK .
Ground reference for analog and
digital circuitry.
Reference Input.
Serial Data is shifted out on this pin.
Data is clocked out by the rising
edges of SCLK .
Serial Clock. An external serial clock
is applied here. T he clock must be
continuous so the RFS (frame SYNC)
can be synchronized to the clock for
high speed data transfers. (See
Microprocessor Interfacing section.)
Positive Supply Voltage 3 V/5 V
±
10%.
2
3
V
IN
RFS
4
GND
5
6
V
REF
D
OUT
7
SCLK
8
V
DD
PIN CONFIGURAT ION
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
CONVST
V
IN
RFS
V
DD
SCLK
D
OUT
V
REF
GND
AD7827
ABSOLUT E MAX IMUM RAT INGS*
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND
(
CONVST
, SCLK ) . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
Digital Output Voltage to GND
(D
OUT
, RFS) . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
V
REF
to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
+ 0.3 V
Analog Input Voltage to AGND . . . . . . –0.3 V, V
DD
+ 0.3 V
Operating T emperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°
C to +105
°
C
Storage T emperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Lead T emperature (Soldering, 10 sec) . . . . . . . . . . . +300
°
C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
T hermal Impedance . . . . . . . . . . . . . . . . . . . +105
°
C/W
Lead T emperature, (Soldering 10 sec) . . . . . . . . . . +260
°
C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
T hermal Impedance . . . . . . . . . . . . . . . . . . . . +75
°
C/W
Lead T emperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. T his is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDE RING GUIDE
Linearity
E rror
(LSB)
Package
Description
Package
Option
Model
AD7827BN
AD7827BR
±
0.5 LSB
±
0.5 LSB
Plastic DIP
Small Outline IC
N-8
SO-8