參數(shù)資料
型號(hào): AD7783BRUZ-REEL7
廠商: Analog Devices Inc
文件頁數(shù): 2/12頁
文件大?。?/td> 0K
描述: IC ADC 24BIT 2CHAN R-R 16TSSOP
標(biāo)準(zhǔn)包裝: 1,000
位數(shù): 24
采樣率(每秒): 19.79
數(shù)據(jù)接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 3.9mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個(gè)差分,單極;1 個(gè)差分,雙極
AD7783
Rev. C | Page 10 of 12
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 1. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
AD7783BRU
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
AD7783BRU-REEL
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
AD7783BRU-REEL7
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
AD7783BRUZ
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
AD7783BRUZ-REEL7
40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
EVAL-AD7783EBZ
40°C to +85°C
Evaluation Board
1 Z = RoHS Compliant Part.
REVISION HISTORY
10/11—Rev. B to Rev. C
Changes to Figure 2...........................................................................5
Changes to Ordering Guide...........................................................10
8/04—Data Sheet Changed from Rev. A to Rev. B.
Change to Features............................................................................1
Changes to Ordering Guide.............................................................5
4/03—Data Sheet Changed from Rev. 0 to Rev. A.
Change to Specifications .................................................................
.2
Updated Outline Dimensions........................................................10
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