TA = 25°C, unless otherwis" />
參數(shù)資料
型號: AD7705BRZ
廠商: Analog Devices Inc
文件頁數(shù): 44/44頁
文件大?。?/td> 0K
描述: IC ADC 16BIT 2CH 16-SOIC
標準包裝: 47
位數(shù): 16
采樣率(每秒): 500
數(shù)據(jù)接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 1mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC W
包裝: 管件
輸入數(shù)目和類型: 2 個差分,單極;2 個差分,雙極
產(chǎn)品目錄頁面: 778 (CN2011-ZH PDF)
配用: EVAL-AD7705EBZ-ND - BOARD EVALUATION FOR AD7705
AD7705/AD7706
Rev. C | Page 9 of 44
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameters
Ratings
VDD to GND
0.3 V to +7 V
Analog Input Voltage to GND
0.3 V to VDD + 0.3 V
Reference Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Output Voltage to GND
0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (B Version)
40°C to + 85°C
Storage Temperature Range
65°C to + 150°C
Junction Temperature
150°C
PDIP Package, Power Dissipation
450 mW
θJA Thermal Impedance
105°C/W
Lead Temperature (Soldering, 10 sec)
260°C
SOIC Package, Power Dissipation
450 mW
θJA Thermal Impedance
75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
SSOP Package, Power Dissipation
450 mW
θJA Thermal Impedance
139°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
ESD Rating
>4000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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