
AD7392/AD7393
Rev. C | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD to GND
0.3 V, +8 V
VREF to GND
0.3 V, VDD
Logic Inputs to GND
0.3 V, VDD + 0.3 V
VOUT to GND
0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND
50 mA
DGND to AGND
0.3 V, +2 V
Package Power Dissipation
(TJ max TA)/θJA
Thermal Resistance (θJA)
20-Lead PDIP (N 20)
57°C/W
20-Lead SOIC (R-20)
60°C/W
Maximum Junction Temperature (TJ max)
150°C
Operating Temperature Range
40°C to +85°C
AD7393AR
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Lead Temperature
Reflow Soldering Peak Temperature
SnPb
240°C
Pb-Free
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION