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參數(shù)資料
| 型號(hào)： | AD558TE |
| 英文描述： | 8-Bit Digital-to-Analog Converter |
| 中文描述： | 8位數(shù)字到模擬轉(zhuǎn)換器 |
| 文件頁數(shù)： | 3/8頁 |
| 文件大小： | 334K |
| 代理商： | AD558TE |
AD558
REV. A
–3–
ABSOLUTE MAXIMUM RATINGS*
V
CC
to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . .0 V to +7.0 V
V
OUT
. . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground
Momentary Short to V
CC
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . .450 mW
Storage Temperature Range
N/P (Plastic) Packages . . . . . . . . . . . . . . . .–25
°
C to +100
°
C
D (Ceramic) Package . . . . . . . . . . . . . . . . .–55
°
C to +150
°
C
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300
°
C
Thermal Resistance
Junction to Ambient/Junction to Case
D (Ceramic) Package . . . . . . . . . . . . . . 100
°
C/W/30
°
C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140
°
C/W/55
°
C/W
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
AD558 METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
Figure 1a. AD558 Pin Configuration (DIP)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
AD558
TOP VIEW
(Not to Scale)
V
OUT
V
OUT
SENSE
V
OUT
SELECT
GND
GND
+V
CC
CS
(LSB) DB0
DB1
DB2
DB3
DB4
DB5
DB6
(MSB) DB7
CE
Figure 1a. AD558 Pin Configuration (DIP)
AD558
TOP VIEW
(Not to Scale)
1
2
3
20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
V
OUT
SELECT
GND
NC
GND
+V
CC
DB2
DB3
NC
DB4
DB5
D
D
N
V
O
V
O
S
D
(
N
C
C
NC = NO CONNECT
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
ORDERING GUIDE
Relative Accuracy
Error Max
T
MIN
to T
MAX
Full-Scale
Error, Max
T
MIN
to T
MAX
Package
Option
2
Model
1
Temperature
AD558JN
AD558JP
AD558JD
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
±
2.5 LSB
±
2.5 LSB
±
2.5 LSB
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
AD558KN
AD558KP
AD558KD
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
±
1/4 LSB
±
1/4 LSB
±
1/4 LSB
±
1 LSB
±
1 LSB
±
1 LSB
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
AD558SD
AD558TD
–55
°
C to +125
°
C
–55
°
C to +125
°
C
±
3/4 LSB
±
3/8 LSB
±
2.5 LSB
±
1 LSB
TO-116 (D-16)
TO-116 (D-16)
NOTES
1
For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices
Military Products Databook or current AD558/883B data sheet.
2
D = Ceramic DIP; N = Plastic DIP; P = Plastic Leaded Chip Carrier.
相關(guān)PDF資料 |
PDF描述 |
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| AD558JD | DACPORT Low Cost, Complete uP-Compatible 8-Bit DAC |
| AD558JN | DACPORT Low Cost, Complete uP-Compatible 8-Bit DAC |
| AD558JP | DACPORT Low Cost, Complete uP-Compatible 8-Bit DAC |
| AD558J | DACPORT Low Cost, Complete uP-Compatible 8-Bit DAC |
| AD558K | DACPORT Low Cost, Complete uP-Compatible 8-Bit DAC |
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