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參數(shù)資料
| 型號： | AD5541AARMZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 19/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 16BIT SERIAL IN 10MSOP |
| 標準包裝： | 1,000 |
| 系列： | nanoDAC™ |
| 設置時間： | 1µs |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 825µW |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應商設備封裝： | 10-MSOP |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | * |
| 采樣率（每秒）： | 1M |
AD5541A
Rev. A | Page 8 of 20
08
51
6-
0
04
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
3
SCLK
4
DIN
1
REF
2
CS
6VOUT
5CLR
8GND
7VDD
TOP VIEW
(Not to Scale)
AD5541A-1
Figure 5. AD5541A-1 8-Lead LFCSP Pin Configuration
08
51
6-
0
05
1
VDD
2
VOUT
3
AGND
4
REF
5
10 VLOGIC
9DGND
8
7DIN
6SCLK
TOP VIEW
(Not to Scale)
AD5541A
CS
LDAC
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
Figure 6. AD5541A 10-Lead LFCSP Pin Configuration
Table 7. AD5541A-1 and AD5541A Pin Function Descriptions
Pin No.
8-Lead LFCSP
10-Lead LFCSP
Mnemonic
Description
1
4
REF
Voltage Reference Input for the DAC. Connect to an external 2.5 V reference. The
reference can range from 2 V to VDD.
2
5
CS
Logic Input Signal. The chip select signal is used to frame the serial data input.
3
6
SCLK
Clock Input. Data is clocked into the serial input register on the rising edge of SCLK.
Duty cycle must be between 40% and 60%.
4
7
DIN
Serial Data Input. This device accepts 16-bit words. Data is clocked into the serial input
register on the rising edge of SCLK.
5
CLR
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all
LDAC pulses are ignored. When CLR is activated, the serial input register and the DAC
register are cleared to zero scale.
6
2
VOUT
Analog Output Voltage from the DAC.
9
DGND
Digital Ground. Ground reference for digital circuitry.
7
1
VDD
Analog Supply Voltage.
8
GND
Ground Reference Point for Both Analog and Digital Circuitry.
3
AGND
Ground Reference Point for Analog Circuitry.
10
VLOGIC
Logic Power Supply.
8
LDAC
LDAC Input. When this input is taken low, the DAC register is simultaneously updated
with the contents of the serial input register.
EPAD
Exposed Pad. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, GND.
1 N/A means not applicable.
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| AD5541ABCPZ-1-RL7 | 功能描述:IC DAC 16BIT SERIAL IN 10MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:nanoDAC™ 標準包裝:47 系列:- 設置時間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應商設備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
| AD5541ABCPZ-REEL7 | 功能描述:IC DAC 16BIT 2.7-5.5V 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:nanoDAC™ 標準包裝:47 系列:- 設置時間:2µs 位數(shù):14 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:55µW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應商設備封裝:28-SSOP 包裝:管件 輸出數(shù)目和類型:1 電流，單極；1 電流，雙極 采樣率（每秒）:* |
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