Table 4. TA = 25°C," />
參數(shù)資料
型號(hào): AD5346BRU
廠商: Analog Devices Inc
文件頁(yè)數(shù): 21/24頁(yè)
文件大?。?/td> 0K
描述: IC DAC 8BIT OCTAL VOUT 38-TSSOP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 50
設(shè)置時(shí)間: 6µs
位數(shù): 8
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 8
電壓電源: 單電源
功率耗散(最大): 8.3mW
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 38-TFSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 38-TSSOP
包裝: 管件
輸出數(shù)目和類型: 8 電壓,單極;8 電壓,雙極
采樣率(每秒): 167k
AD5346/AD5347/AD5348
Rev. 0 | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4. TA = 25°C, unless otherwise noted
Parameter
Rating
VDD to GND
–0.3 V to +7 V
Digital Input Voltage to GND
–0.3 V to VDD + 0.3 V
Digital Output Voltage to GND
–0.3 V to VDD + 0.3 V
Reference Input Voltage to GND
–0.3 V to VDD + 0.3 V
VOUT to GND
–0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
–40°C to +105°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
38-Lead TSSOP Package
Power Dissipation
(TJ max TA)/ θJA mW
θJA Thermal Impedance
98.3°C/W
θJC Thermal Impedance
8.9°C/W
40-Lead LFCSP Package
Power Dissipation
(TJ max TA)/ θJA mW
θJA Thermal Impedance (3-layer
board)
29.6°C/W
Lead Temperature, Soldering (10 sec)
300°C
IR Reflow, Peak Temperature
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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