參數(shù)資料
型號(hào): AD5336BRU-REEL7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 15/20頁(yè)
文件大?。?/td> 0K
描述: IC DAC 10BIT QUAD VOUT 28-TSSOP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
產(chǎn)品變化通告: Product Discontinuance 27/Oct/2011
標(biāo)準(zhǔn)包裝: 1,000
設(shè)置時(shí)間: 7µs
位數(shù): 10
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 4
電壓電源: 單電源
功率耗散(最大): 4.5mW
工作溫度: -40°C ~ 105°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 28-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 28-TSSOP
包裝: 帶卷 (TR)
輸出數(shù)目和類(lèi)型: 4 電壓,單極;4 電壓,雙極
采樣率(每秒): 143k
REV. 0
AD5334/AD5335/AD5336/AD5344
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD5334/AD5335/AD5336/AD5344 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to GND . . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V
VOUT to GND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
TSSOP Package
Power Dissipation . . . . . . . . . . . . . . . (TJ max – TA)/
θJA mW
θJA Thermal Impedance (24-Lead TSSOP) . . . . . 128°C/W
θ
JA Thermal Impedance (28-Lead TSSOP) . . . . . 97.9
°C/W
θJC Thermal Impedance (24-Lead TSSOP) . . . . . . 42°C/W
θJC Thermal Impedance (28-Lead TSSOP) . . . . . . 14°C/W
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . 220 +5/–0
°C
Time at Peak Temperature . . . . . . . . . . . . .10 sec to 40 sec
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specication is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD5334BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-24
AD5335BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-24
AD5336BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-28
AD5344BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-28
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