AD5293
Rev. D | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
Rating
VDD to GND
0.3 V to +35 V
VSS to GND
+0.3 V to 25 V
VLOGIC to GND
0.3 V to +7 V
VDD to VSS
35 V
VA, VB, VW to GND
VSS 0.3 V, VDD + 0.3 V
Digital Input and Output Voltage to GND
0.3 V to VLOGIC +0.3 V
EXT_CAP Voltage to GND
0.3 V to +7 V
IA, IB, IW
Continuous
RAB = 20 kΩ
±3 mA
RAB = 50 kΩ, 100 kΩ
±2 mA
Frequency > 10 kHz
Frequency ≤ 10 kHz
Operating Temperature Range
40°C to +105°C
Maximum Junction Temperature (TJ max)
150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max TA)/θJA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
14-Lead TSSOP
20
°C/W
1 JEDEC 2S2P test board, still air (from 0 m/sec to 1 m/sec of air flow).
ESD CAUTION
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Maximum continuous current.
3 Pulse duty factor.