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參數(shù)資料
| 型號： | ACPM-7886-TR1 |
| 元件分類： | 放大器 |
| 英文描述： | 2010 MHz - 2025 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 4.0 X 4.0 MM, LEAD FREE, SMT, 10 PIN |
| 文件頁數(shù)： | 13/14頁 |
| 文件大?。?/td> | 339K |
| 代理商： | ACPM-7886-TR1 |
8
Solder Reow Prole
The most commonly used solder reow method is ac-
complished in a belt furnace using convection heat trans-
fer. This prole is designed to ensure reliable nished
joints. However, the prole indicated will vary among
dierent solder pastes from dierent manufacturers and
is shown here for reference only.
Other factors that can aect the prole include the
density and types of components on the board, type
of solder used and type of board or substrate material
being used. The prole shows the actual temperature
that should occur on the surface of a test board at or
near the central of the solder joint. For this type of reow
soldering, the circuit board and solder joints are rst to
get heated up. The components on the board are then
Suggested Board Implementation
Notes:
1. All decoupling capacitors should be placed as close to the power module as possible.
2. RFin (Pin 2) has a grounded inductor inside package as a matching element. An external series capacitor is needed if a DC voltage is present.
3. An additional battery bypass capacitor should be placed on bias line before the battery terminal, but does not need to be immediately adja-
cent to the PA module. The bypass capacitor should be a large value, nominally between 2.2uF and 4.7uF.
4. Trace impedance on RF lines should be 50
:.
C5 (10,000pF)
C1 (4700pF)
C2 (4700pF)
C4 (33pF)
C3 (33pF)
GND
heated by conduction. The circuit board, because it has a
large surface area, absorbs thermal energy eciently and
distributes this heat to the components.
Reow temperature proles designed for tin/lead alloys
will need to be revised accordingly to cater for the
melting point of the lead free solder being 34°C (54°F)
higher than that of tin/lead eutectic or near-eutectic
alloys. In addition, the surface tension of molten lead
free solder alloys is signicantly higher than the surface
tension for tin/lead alloys and this can reduce the spread
of lead free solder during reow.
250
200
150
100
Melting point = 218°C
Suggested Lead Free Reow Prole For SnAgCu Solder Paste
0
50
100
150
200
250
Seconds
Ramp 1
Preheat
Ramp 2
Reow
Cooling
50
Peak = 250 ± 5°C
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