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參數(shù)資料
| 型號： | ACPM-1403 |
| 元件分類： | 放大器 |
| 英文描述： | 1920 MHz - 1940 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, 8 PIN |
| 文件頁數(shù)： | 4/16頁 |
| 文件大?。?/td> | 406K |
| 代理商： | ACPM-1403 |
12
Table 6. Moisture Classification Level and Floor Life
MSL Level
Floor Life (Out of Bag) at Factory Ambient = < 30°C/60% RH or As Stated
1
Unlimited at = < 30°C/85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note:
1. The MSL Level is marked on the MSL Label on each shipping bag.
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet
of neutralization or discharge will be sought. If the
acquired discharge route is through a semiconductor
device, destructive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling
in a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is
sensitive to damage induced by absorbed moisture and
temperature.
Avago Technologies follows JEDEC Standard J-STD
020B. Each component and package type is classified
for moisture sensitivity by soaking a known dry package
at various temperatures and relative humidity, and
times. After soak, the components are subjected to
three consecutive simulated reflows.
The out of bag exposure time maximum limits are de-
termined by the classification test describe below which
corresponds to a MSL classification level 6 to 1 according
to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-
033.
ACPM-1403 is MSL3. Thus, according to the J-STD-033
p.11 the maximum Manufacturers Exposure Time (MET)
for this part is 168 hours. After this time period, the
part would need to be removed from the reel,
de-taped and then re-baked. MSL classification re-
flow temperature for the ACPM-1403 is targeted at
260°C +0/-5°C. Figure 26 and Table 7 show typical SMT
profile for maximum temperature of 260 +0/-5°C.
Table 5. ESD Classification
Pin #
Name
Description
HBM
CDM
Classification
1
Vref
Reference Voltage
±2000 V
±200 V
Class 2
2
Vcont
Control Voltage
±2000 V
±200 V
Class 2
3
RF In
RF Input
±2000 V
±200 V
Class 2
4
Vcc1
Supply Voltage
±2000 V
±200 V
Class 2
5
Vcc2
Supply Voltage
±2000 V
±200 V
Class 2
6
RF Out
RF Output
±2000 V
±200 V
Class 2
7
GND
Ground
±2000 V
±200 V
Class 2
8
GND
Ground
±2000 V
±200 V
Class 2
Note:
1. Module products should be considered extremely ESD sensitive.
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