參數(shù)資料
型號(hào): ACPM-1403
元件分類: 放大器
英文描述: 1920 MHz - 1940 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封裝: 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, 8 PIN
文件頁數(shù): 16/16頁
文件大?。?/td> 406K
代理商: ACPM-1403
9
Figure 21. Metallization
Figure 22. Solder mask opening
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown in Figure 23.
Reducing the stencil opening can potentially generate
more voids. On the other hand, stencil openings larger
than 100% will lead to excessive solder paste smear or
bridging across the I/O pads or conductive paddle to ad-
jacent I/O pads. Considering the fact that solder paste
thickness will directly affect the quality of the solder
joint, a good choice is to use laser cut stencil composed
of 0.100 mm (4 mils) or 0.127 mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline.
Figure 23. Solder paste stencil aperture
0.1
0.25
0.6
0.5
0.4
0.8
0.3 mm ON
0.5 mm PITCH
0.8
0.5
0.7
0.55
1.4
1.325
0.4
0.6
0.5
0.8
1.05
1.1
Figure 20. CDMA power distribution function
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0
700
600
CDG Urban
Conventional PAM
Digitally Controlled PAM
Cool PAM
CDG Suburban
500
400
300
200
100
0
-50
-40
-30
-20
-10
PA Out (dBm)
0
PDF
(%)
CURRENT
(mA)
10
20
30
Average Current and Talk Time
Probability Distribution Function implies that what is
important for longer talk time is the efficiency of low or
medium power range rather than the efficiency at full
power. ACPM-1403 idle current is 12 mA and operating
current at 17 dBm is 65 mA at nominal condition. This PA
with low current consumption prolongs talk time by no
less than 30 minutes compared to other PAs.
Average current = ∫(PDF x Current)dp
PCB Design Guidelines
The recommended ACPM-1403 PCB land pattern is
shown in Figure 21 and Figure 22. The substrate is coat-
ed with solder mask between the I/O and conductive
paddle to protect the gold pads from short circuit that is
caused by solder bleeding/bridging.
相關(guān)PDF資料
PDF描述
ACPM-5005-BLK 815 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
ACPM-5005-TR1 815 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
ACPM-5013-BLK 777 MHz - 798 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
ACPM-5013-TR1 777 MHz - 798 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
ACPM-5205-TR1 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
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