參數(shù)資料
型號(hào)： A54SXxx
廠商： Electronic Theatre Controls, Inc.
元件分類(lèi)： FPGA
英文描述： 54SX Family FPGAs
中文描述： 54SX家庭的FPGA
文件頁(yè)數(shù)： 18/57頁(yè)
文件大?。?/td> 415K
代理商： A54SXXX
5 4 S X F a m ily F P G A s
18
v3.1
E v a lua t ing P ow e r in 5 4 S X De v ic e s
A critical element of system reliability is the ability of
electronic devices to safely dissipate the heat generated
during operation. The thermal characteristics of a circuit
depend on the device and package used, the operating
temperature, the operating current, and the systems ability
to dissipate heat.
You should complete a power evaluation early in the design
process to help identify potential heat-related problems in
the system and to prevent the system from exceeding the
device’s maximum allowed junction temperature.
The actual power dissipated by most applications is
significantly lower than the power the package can
dissipate. However, a thermal analysis should be performed
for all projects. To perform a power evaluation, follow these
steps:
Estimate the power consumption of the application.
Calculate the maximumpower allowed for the device and
package.
Compare the estimated power and maximumpower
values.
E s t im a t ing P ow e r C ons um pt ion
The total power dissipation for the 54SX family is the sum of
the DC power dissipation and the AC power dissipation. Use
Equation1 to calculate the estimated power consumption of
your application.
P
Total
= P
DC
+ P
AC
(1)
DC P ow e r Dis s ipa t ion
The power due to standby current is typically a small
component of the overall power. The Standby power is
shown below for commercial, worst case conditions (70
°
C).
The DC power dissipation is defined in Equation 2 as
follows:
P
DC
= (I
standby
)*V
CCA
+ (I
standby
)*V
CCR
+
(I
standby
)*V
CCI
+ x*V
OL
*I
OL
+ y*(V
CCI
– V
OH
)*V
OH
(2)
A C P ow e r Dis s ipa t ion
The power dissipation of the 54SX Family is usually
dominated by the dynamic power dissipation. Dynamic
power dissipation is a function of frequency, equivalent
capacitance and power supply voltage. The AC power
dissipation is defined as follows:
P
AC
= P
Module
+ P
RCLKA Net
+ P
RCLKB Net
+ P
HCLK Net
+
P
Output Buffer
+ P
Input Buffer
P
AC
= V
CCA2
* [(m * C
EQM
* f
m
)
Module
+
(n * C
EQI
* f
n
)
Input Buffer
+ (p * (C
EQO
+ C
L
) * f
p
)
Output Buffer
+
(0.5 * (q
1
* C
EQCR
* f
q1
) + (r
1
* f
q1
))
RCLKA
+
(0.5 * (q
2
* C
EQCR
* f
q2
)+ (r
2
* f
q2
))
RCLKB
+
(0.5 * (s
1
* C
EQHV
* f
s1
) + (C
EQHF
* f
s1
))
HCLK
]
(3)
(4)
De finit ion of T e rm s U s e d in F orm ula
m
= Number of logic modules switching at f
m
n
= Number of input buffers switching at f
n
p
= Number of output buffers switching at f
p
q
1
= Number of clock loads on the first routed array
clock
q
2
= Number of clock loads on the second routed
array clock
x
= Number of I/Os at logic low
y
= Number of I/Os at logic high
r
1
= Fixed capacitance due to first routed array
clock
r
2
= Fixed capacitance due to second routed array
clock
s
1
= Number of clock loads on the dedicated array
clock
C
EQM
= Equivalent capacitance of logic modules in pF
C
EQI
= Equivalent capacitance of input buffers in pF
C
EQO
= Equivalent capacitance of output buffers in pF
C
EQCR
= Equivalent capacitance of routed array clock in
pF
C
EQHV
= Variable capacitance of dedicated array clock
C
EQHF
= Fixed capacitance of dedicated array clock
C
L
= Output lead capacitance in pF
f
m
= Average logic module switching rate in MHz
f
n
= Average input buffer switching rate in MHz
f
p
= Average output buffer switching rate in MHz
f
q1
= Average first routed array clock rate in MHz
f
q2
= Average second routed array clock rate in MHz
f
s1
= Average dedicated array clock rate in MHz
A54SX08 A54SX16 A54SX16P A54SX32
C
EQM
(pF) 4.0
4.0
C
EQI
(pF)
3.4
3.4
C
EQO
(pF) 4.7
4.7
C
EQCR
(pF) 1.6
1.6
C
EQHV
0.615
0.615
C
EQHF
60
96
r
1
(pF)
87
138
r
2
(pF)
87
138
Table 3
I
CC
4mA
V
CC
3.6V
Power
14.4mW
4.0
3.4
4.7
1.6
0.615
96
138
138
4.0
3.4
4.7
1.6
0.615
140
171
171
相關(guān)PDF資料
PDF描述
A54SX08P-1BG208 Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:128; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
A54SX08P-1BG208I Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:128; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
A54SX08P-1BG208M Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:128; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
A54SX08P-1BG208PP Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; Number of Contacts:128; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
A54SX08P-1FG208 Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:128; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
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