參數(shù)資料
型號： A54SX16-3TQ208PP
廠商： Electronic Theatre Controls, Inc.
英文描述： LM199/LM299/LM399 Precision Reference
中文描述： 54SX家庭的FPGA
文件頁數(shù)： 18/57頁
文件大?。?/td> 415K
代理商： A54SX16-3TQ208PP
5 4 S X F a m ily F P G A s
18
v3.1
E v a lua t ing P ow e r in 5 4 S X De v ic e s
A critical element of system reliability is the ability of
electronic devices to safely dissipate the heat generated
during operation. The thermal characteristics of a circuit
depend on the device and package used, the operating
temperature, the operating current, and the systems ability
to dissipate heat.
You should complete a power evaluation early in the design
process to help identify potential heat-related problems in
the system and to prevent the system from exceeding the
device’s maximum allowed junction temperature.
The actual power dissipated by most applications is
significantly lower than the power the package can
dissipate. However, a thermal analysis should be performed
for all projects. To perform a power evaluation, follow these
steps:
Estimate the power consumption of the application.
Calculate the maximumpower allowed for the device and
package.
Compare the estimated power and maximumpower
values.
E s t im a t ing P ow e r C ons um pt ion
The total power dissipation for the 54SX family is the sum of
the DC power dissipation and the AC power dissipation. Use
Equation1 to calculate the estimated power consumption of
your application.
P
Total
= P
DC
+ P
AC
(1)
DC P ow e r Dis s ipa t ion
The power due to standby current is typically a small
component of the overall power. The Standby power is
shown below for commercial, worst case conditions (70
°
C).
The DC power dissipation is defined in Equation 2 as
follows:
P
DC
= (I
standby
)*V
CCA
+ (I
standby
)*V
CCR
+
(I
standby
)*V
CCI
+ x*V
OL
*I
OL
+ y*(V
CCI
– V
OH
)*V
OH
(2)
A C P ow e r Dis s ipa t ion
The power dissipation of the 54SX Family is usually
dominated by the dynamic power dissipation. Dynamic
power dissipation is a function of frequency, equivalent
capacitance and power supply voltage. The AC power
dissipation is defined as follows:
P
AC
= P
Module
+ P
RCLKA Net
+ P
RCLKB Net
+ P
HCLK Net
+
P
Output Buffer
+ P
Input Buffer
P
AC
= V
CCA2
* [(m * C
EQM
* f
m
)
Module
+
(n * C
EQI
* f
n
)
Input Buffer
+ (p * (C
EQO
+ C
L
) * f
p
)
Output Buffer
+
(0.5 * (q
1
* C
EQCR
* f
q1
) + (r
1
* f
q1
))
RCLKA
+
(0.5 * (q
2
* C
EQCR
* f
q2
)+ (r
2
* f
q2
))
RCLKB
+
(0.5 * (s
1
* C
EQHV
* f
s1
) + (C
EQHF
* f
s1
))
HCLK
]
(3)
(4)
De finit ion of T e rm s U s e d in F orm ula
m
= Number of logic modules switching at f
m
n
= Number of input buffers switching at f
n
p
= Number of output buffers switching at f
p
q
1
= Number of clock loads on the first routed array
clock
q
2
= Number of clock loads on the second routed
array clock
x
= Number of I/Os at logic low
y
= Number of I/Os at logic high
r
1
= Fixed capacitance due to first routed array
clock
r
2
= Fixed capacitance due to second routed array
clock
s
1
= Number of clock loads on the dedicated array
clock
C
EQM
= Equivalent capacitance of logic modules in pF
C
EQI
= Equivalent capacitance of input buffers in pF
C
EQO
= Equivalent capacitance of output buffers in pF
C
EQCR
= Equivalent capacitance of routed array clock in
pF
C
EQHV
= Variable capacitance of dedicated array clock
C
EQHF
= Fixed capacitance of dedicated array clock
C
L
= Output lead capacitance in pF
f
m
= Average logic module switching rate in MHz
f
n
= Average input buffer switching rate in MHz
f
p
= Average output buffer switching rate in MHz
f
q1
= Average first routed array clock rate in MHz
f
q2
= Average second routed array clock rate in MHz
f
s1
= Average dedicated array clock rate in MHz
A54SX08 A54SX16 A54SX16P A54SX32
C
EQM
(pF) 4.0
4.0
C
EQI
(pF)
3.4
3.4
C
EQO
(pF) 4.7
4.7
C
EQCR
(pF) 1.6
1.6
C
EQHV
0.615
0.615
C
EQHF
60
96
r
1
(pF)
87
138
r
2
(pF)
87
138
Table 3
I
CC
4mA
V
CC
3.6V
Power
14.4mW
4.0
3.4
4.7
1.6
0.615
96
138
138
4.0
3.4
4.7
1.6
0.615
140
171
171
相關(guān)PDF資料
PDF描述
A54SX16-3VQ208 54SX Family FPGAs
A54SX16-3VQ208I LM199/LM299/LM399 Precision Reference; Package: TO-46; No of Pins: 4
A54SX16-3VQ208M 54SX Family FPGAs
A54SX16-3VQ208PP LM19 2.4V, 10μA, TO-92 Temperature Sensor; Package: TO-92; No of Pins: 3; Qty per Container: 1800; Container: Box
A54SX16-BG208 54SX Family FPGAs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX16A-1FG144 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17）
A54SX16A-1FG144I 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17）
A54SX16A-1FG144M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 16K GATES 924 CELLS 263MHZ 0.25UM/0.22UM 2.5V 144F - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 111 I/O 144FBGA
A54SX16A-1FG256 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17）
A54SX16A-1FG256I 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27）
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*