參數(shù)資料
型號: A42MX09-3PQ160
廠商: Microsemi SoC
文件頁數(shù): 45/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 14K 160-PQFP
標準包裝: 24
系列: MX
輸入/輸出數(shù): 101
門數(shù): 14000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 160-BQFP
供應商設備封裝: 160-PQFP(28x28)
Re vi s i on 11
3-1
3 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Changes
Page
Revision 11
(May 2012)
The FuseLock logo and accompanying text was removed from the "User Security"
section. This marking is no longer used on Microsemi devices (PCN 0915).
The "Development Tool Support" section was updated (SAR 38512).
Revision 10
(April 2012)
"Ordering Information" was updated to include lead-free package ordering codes
(SAR 21968).
The "User Security" section was revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement the best
security available in the industry (SAR 34673).
The "Transient Current" section is new (SAR 36930).
Package names were revised according to standards established in Package
Revision 9
(v6.1, April 2009)
In Table 1-14 Absolute Maximum Ratings*, the limits in VI were changed from -0.5 to
VCCI + 0.5 to -0.5 to VCCA + 0.5.
to 2.4 for the min in industrial and military. VIH had VCCI and that was changed to
VCCA.
v6.0
(January 2004)
The "User Security" section was updated.
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相關代理商/技術參數(shù)
參數(shù)描述
A42MX09-3PQ160I 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX09-3PQ160M 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A42MX09-3PQG100 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX09-3PQG100I 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX09-3PQG160 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)