tADH Addres" />
參數(shù)資料
型號: A40MX02-2VQG80I
廠商: Microsemi SoC
文件頁數(shù): 126/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 3K 80-VQFP
標準包裝: 90
系列: MX
輸入/輸出數(shù): 57
門數(shù): 3000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 80-TQFP
供應商設備封裝: 80-VQFP(14x14)
40MX and 42MX FPGA Families
1- 80
R e v i sio n 1 1
Synchronous SRAM Operations (continued)
tADH
Address/Data Hold Time
0.0
ns
tRENSU
Read Enable Set-Up
0.9
1.0
1.1
1.3
1.8
ns
tRENH
Read Enable Hold
4.8
5.3
6.0
7.0
9.8
ns
tWENSU
Write Enable Set-Up
3.8
4.2
4.8
5.6
7.8
ns
tWENH
Write Enable Hold
0.0
ns
tBENS
Block Enable Set-Up
3.9
4.3
4.9
5.7
8.0
ns
tBENH
Block Enable Hold
0.0
ns
Asynchronous SRAM Operations
tRPD
Asynchronous Access Time
11.3
12.6
14.3
16.8
23.5
ns
tRDADV
Read Address Valid
12.3
13.7
15.5
18.2
25.5
ns
tADSU
Address/Data Set-Up Time
2.3
2.5
2.8
3.4
4.8
ns
tADH
Address/Data Hold Time
0.0
ns
tRENSUA
Read Enable Set-Up to Address
Valid
0.9
1.0
1.1
1.3
1.8
ns
tRENHA
Read Enable Hold
4.8
5.3
6.0
7.0
9.8
ns
tWENSU
Write Enable Set-Up
3.8
4.2
4.8
5.6
7.8
ns
tWENH
Write Enable Hold
0.0
ns
tDOH
Data Out Hold Time
1.8
2.0
2.1
2.5
3.5
ns
Input Module Propagation Delays
tINPY
Input Data Pad-to-Y
1.4
1.6
1.8
2.1
3.0
ns
tINGO
Input Latch Gate-to-Output
2.0
2.2
2.5
2.9
4.1
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Set-Up
0.7
0.8
1.0
1.4
ns
tILA
Latch Active Pulse Width
6.5
7.3
8.2
9.7
13.5
ns
Table 1-39 A42MX36 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed –F Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相關PDF資料
PDF描述
A40MX02-2VQ80I IC FPGA MX SGL CHIP 3K 80-VQFP
A42MX16-FTQ176 IC FPGA MX SGL CHIP 24K 176-TQFP
A3P400-2FGG256I IC FPGA 1KB FLASH 400K 256-FBGA
M1A3P400-2FG256I IC FPGA 1KB FLASH 400K 256-FBGA
EP4CGX22BF14C6N IC CYCLONE IV GX FPGA 22K 169FBG
相關代理商/技術參數(shù)
參數(shù)描述
A40MX02-3PL44 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
A40MX02-3PL44I 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
A40MX02-3PL44M 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A40MX02-3PL68 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
A40MX02-3PL68I 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)