5-4 Revision 13 Revision Changes Page Revision 9 (Aug 2009) Product Brief v1.2 All references to speed grade –F have been re" />
參數(shù)資料
型號： A3PE600-2FGG256
廠商： Microsemi SoC
文件頁數(shù)： 62/162頁
文件大?。?/td> 0K
描述： IC FPGA 600000 GATES 256-FBGA
標準包裝： 90
系列： ProASIC3E
RAM 位總計： 110592
輸入/輸出數(shù)： 165
門數(shù)： 600000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 256-LBGA
供應商設備封裝： 256-FPBGA（17x17）
Datasheet Information
5-4
Revision 13
Revision
Changes
Page
Revision 9 (Aug 2009)
Product Brief v1.2
All references to speed grade –F have been removed from this document.
N/A
definitions of hot-swap and cold-sparing.
DC
and
Switching
Characteristics v1.3
3.3 V LVCMOS and 1.2 V LVCMOS Wide Range support was added to the
datasheet. This affects all tables that contained 3.3 V LVCMOS and 1.2 V
LVCMOS data.
N/A
IIL and IIH input leakage current information was added to all "Minimum and
Maximum DC Input and Output Levels" tables.
N/A
–F was removed from the datasheet. The speed grade is no longer supported.
N/A
voltage" and note 4 are new.
table was updated.
There are new parameters and data was updated in the Table 2-99 RAM4K9
table.
There are new parameters and data was updated in the Table 2-100
Revision 8 (Feb 2008)
Product Brief v1.1
Revision 7 (Jun 2008)
DC
and
Switching
Characteristics v1.2
remove "as measured on quiet I/Os." Table note 2 was revised to remove
"estimated SSO density over cycles." Table note 3 was deleted
.
updated.
Revision 6 (Jun 2008) The A3PE600 "FG484" table was missing G22. The pin and its function were
added to the table.
Revision 5 (Jun 2008)
Packaging v1.4
The naming conventions changed for the following pins in the "FG484" for the
A3PE600:
Pin Number
New Function Name
J19
IO45PPB2V1
K20
IO45NPB2V1
M2
IO114NPB6V1
N1
IO114PPB6V1
N4
GFC2/IO115PPB6V1
P3
IO115NPB6V1
Revision 4 (Apr 2008)
Product Brief v1.0
The product brief portion of the datasheet was divided into two sections and given
a version number, starting at v1.0. The first section of the document includes
features, benefits, ordering information, and temperature and speed grade
offerings. The second section is a device family overview.
N/A
Packaging v1.3
The "FG324" package diagram was replaced.
相關PDF資料
PDF描述
A3PE600-2FG256 IC FPGA 600000 GATES 256-FBGA
A3PE600-FG484 IC FPGA 600000 GATES 484-FBGA
RSC50DRYN-S734 CONN EDGECARD 100PS DIP .100 SLD
RMC50DRYN-S734 CONN EDGECARD 100PS DIP .100 SLD
RSC50DRYH-S734 CONN EDGECARD 100PS DIP .100 SLD
相關代理商/技術參數(shù)
參數(shù)描述
A3PE600-2FGG256I 功能描述:IC FPGA 600000 GATES 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27）
A3PE600-2FGG484 功能描述:IC FPGA 600000 GATES 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17）
A3PE600-2FGG484I 功能描述:IC FPGA 600000 GATES 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27）
A3PE600-2FGG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE600-2FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
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