參數(shù)資料
型號(hào): A3P600-FGG144
廠商: Microsemi SoC
文件頁(yè)數(shù): 26/27頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 235I/O 144FBGA
標(biāo)準(zhǔn)包裝: 160
系列: ProASIC3
RAM 位總計(jì): 110592
輸入/輸出數(shù): 97
門數(shù): 600000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 144-LBGA
供應(yīng)商設(shè)備封裝: 144-FPBGA(13x13)
其它名稱: 1100-1034
8 www.microsemi.com/soc
IGLOO
UltralowpowerinFlash*Freeze
mode,aslowas2W
Varietyofsmallfootprint
packages as small as 3x3 mm
Zerolead-timeonselecteddevices
Knowngooddiesupported
Enhancedcommercialtemperature
Reprogrammableflashtechnology
1.2Vto1.5Vsingle
voltage operation
EnhancedI/Ofeatures
Clockconditioningcircuits(CCCs)
and PLLs
EmbeddedSRAMand
nonvolatilememory(NVM)
ISPandsecurity
IGLOO nano
IGLOO nano Devices
I/Os Per Package
IGLOO nano Devices
AGLN010
AGLN020
AGLN060
AGLN125
AGLN250
Known Good Die
34
52
71
68
UC36
23
QN48
34
QN68
49
UC81
52
CS81
52
60
VQ100
71
68
Theindustry’slowestpower,smallest-sizesolution
IGLOO nano products offer groundbreaking possibilities in power, size, lead-times, operating temperature and cost. Available in logic densities from 10,000 to
250,000 gates, the 1.2 V to 1.5 V IGLOO nano devices have been designed for high-volume applications where power and size are key decision criteria.
IGLOO nano devices are perfect ASIC or ASSP replacements, yet retain the historical FPGA advantages of flexibility and quick time-to-market in low power
and small footprint profiles.
Notes:
1. AGLN030 and smaller devices do not support this feature.
2. AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs.
3. For higher densities and support of additional features, refer to the IGLOO and IGLOOe datasheets and FPGA fabric user’s guides.
Note:
* When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not used as a regular I/O, the number of single-ended user I/Os available is reduced by one.
IGLOO nano Devices
AGLN010
AGLN020
AGLN060
AGLN125
AGLN250
System Gates
10,000
20,000
60,000
125,000
250,000
Typical Equivalent Macrocells
86
172
512
1,024
2,048
VersaTiles(D-flip-flops)
260
520
1,536
3,072
6,144
Flash*FreezeMode(typical,W)
2
4
10
16
24
RAMKbits1(1,024bits)
18
36
4,608-BitBlocks1
4
8
FlashROMKbits(1,024bits)
1
AES-Protected ISP1
Yes
Integrated PLL in CCCs1,2
1
VersaNetGlobals
4
18
I/OBanks
2
3
2
4
Maximum User I/Os (packaged device)
34
52
71
68
Known Good Die User I/Os
34
52
71
68
Package Pins
UC
CS
QN
VQ
UC36
QN48
UC81
CS81
QN68
CS81
VQ100
CS81
VQ100
CS81
VQ100
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3P600-FGG144ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P600-FGG144I 功能描述:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A3P600-FGG144PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P600-FGG256 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A3P600-FGG256I 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)