ProASIC3 DC and Switching Characteristics
2-14
Revision 13
User I/O Characteristics
Timing Model
Figure 2-2 Timing Model
Operating Conditions: –2 Speed, Commercial Temperature Range (TJ = 70°C), Worst Case
VCC = 1.425 V
DQ
Y
DQ
Y
Combinational Cell
I/O Module
(Registered)
I/O Module
(Non-Registered)
Register Cell
I/O Module
(Registered)
I/O Module
(Non-Registered)
LVPECL (Applicable to
Advanced I/O Banks Only)L
LVPECL
(Applicable
to Advanced
I/O Banks only)
LVDS,
BLVDS,
M-LVDS
(Applicable for
Advanced I/O
Banks only)
LVTTL 3.3 V Output drive
strength = 12 mA High slew rate
Y
Combinational Cell
Y
Combinational Cell
Y
Combinational Cell
I/O Module
(Non-Registered)
LVTTLOutput drive strength = 8 mA
High slew rate
I/O Module
(Non-Registered)
LVCMOS 1.5 VOutput drive strength = 4 mA
High slew rate
LVTTLOutput drive strength = 12 mA
High slew rate
I/O Module
(Non-Registered)
Input LVTTL
Clock
Input LVTTL
Clock
Input LVTTL
Clock
tPD = 0.56 ns
tPD = 0.49 ns
tDP = 1.34 ns
tPD = 0.87 ns
tDP = 2.64 ns (Advanced I/O Banks)
tPD = 0.47 ns
tDP = 3.66 ns (Advanced I/O Banks)
tPD = 0.47 ns
tDP = 3.97 ns (Advanced I/O Banks)
tPD = 0.47 ns
tPY = 0.76 ns
(Advanced I/O Banks)
tCLKQ = 0.55 ns
tOCLKQ = 0.59 ns
tSUD = 0.43 ns
tOSUD = 0.31 ns
tDP = 2.64 ns
(Advanced I/O Banks)
tPY = 0.76 ns (Advanced I/O Banks)
tPY = 1.20 ns
tCLKQ = 0.55 ns
tSUD = 0.43 ns
tPY = 0.76 ns
(Advanced I/O Banks)
tICLKQ = 0.24 ns
tISUD = 0.26 ns
tPY = 1.05 ns