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參數(shù)資料
| 型號(hào)： | A3P1000 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | FPGA |
| 英文描述： | ProASIC3 Flash Family FPGAs with Optional Soft ARM Support |
| 中文描述： | 的ProASIC3閃存系列FPGA支持可選軟ARM |
| 文件頁數(shù)： | 6/11頁 |
| 文件大?。?/td> | 176K |
| 代理商： | A3P1000 |
ProASIC3 Flash Family FPGAs
6
Product Brief
and PCB area, and increases security and system
reliability.
Live at Power-Up
The Actel Flash-based ProASIC3 devices support Level 0
of the LAPU classification standard. This feature helps in
system component initialization, execution of critical
tasks before the processor wakes up, setup and
configuration of memory blocks, clock generation, and
bus activity management. The LAPU feature of Flash-
based ProASIC3 devices greatly simplifies total system
design and reduces total system cost, often eliminating
the need for CPLDs and clock generation PLLs that are
used for these purposes in a system. In addition, glitches
and brownouts in system power will not corrupt the
ProASIC3 device's Flash configuration, and unlike SRAM-
based FPGAs, the device will not have to be reloaded
when system power is restored. This enables the
reduction or complete removal of the configuration
PROM, expensive voltage monitor, brownout detection,
and clock generator devices from the PCB design. Flash-
based ProASIC3 devices simplify total system design and
reduce cost and design risk while increasing system
reliability and improving system initialization time.
Firm Errors
Firm errors occur most commonly when high-energy
neutrons, generated in the upper atmosphere, strike a
configuration cell of an SRAM FPGA. The energy of the
collision can change the state of the configuration cell
and thus change the logic, routing, or I/O behavior in an
unpredictable way. These errors are impossible to
prevent in SRAM FPGAs. The consequence of this type of
error can be a complete system failure. Firm errors do
not exist in the configuration memory of ProASIC3 Flash-
based FPGAs. Once it is programmed, the Flash cell
configuration element of ProASIC3 FPGAs cannot be
altered by high-energy neutrons and is therefore
immune to them. Recoverable (or soft) errors occur in
the user data SRAM of all FPGA devices. These can easily
be mitigated by using error detection and correction
(EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based
characteristics similar to an ASIC, making them an ideal
choice for power-sensitive applications. ProASIC3 devices
have only a very limited power-on current surge and no
high-current transition period, both of which occur on
many FPGAs.
ProASIC3
devices
exhibit
power
ProASIC3 devices also have low dynamic power
consumption to further maximize power savings.
Advanced Flash Technology
The ProASIC3 family offers many benefits, including
nonvolatility
and
reprogrammability
advanced Flash-based, 130-nm LVCMOS process with
seven layers of metal. Standard CMOS design techniques
are used to implement logic and control functions. The
combination of fine granularity, enhanced flexible
routing resources, and abundant Flash switches allows
for very high logic utilization without compromising
device routability or performance. Logic functions within
the device are interconnected through a four-level
routing hierarchy.
through
an
Advanced Architecture
The
proprietary
granularity comparable to standard-cell ASICs. The
ProASIC3
device
consists
programmable architectural features (
Figure 1
and
Figure 2 on page 7
):
FPGA VersaTiles
Dedicated FlashROM
Dedicated SRAM/FIFO memory
1
Extensive CCCs and PLLs
1
Advanced I/O structure
The FPGA core consists of a sea of VersaTiles. Each
VersaTile can be configured as a three-input logic
function, a D-flip-flop (with or without enable), or a
latch by programming the appropriate Flash switch
interconnections. The versatility of the ProASIC3 core tile
as either a three-input lookup table (LUT) equivalent or
as a D-flip-flop/latch with enable allows for efficient use
of the FPGA fabric. The VersaTile capability is unique to
the Actel ProASIC family of third-generation architecture
Flash FPGAs. VersaTiles are connected with any of the
four levels of routing hierarchy. Flash switches are
distributed
throughout
nonvolatile, reconfigurable interconnect programming.
Maximum core utilization is possible for virtually any
design.
In addition, extensive on-chip programming circuitry
allows for rapid, single-voltage (3.3 V) programming of
ProASIC3 devices via an IEEE 1532 JTAG interface.
ProASIC3
architecture
provides
of
five
distinct
and
the
device
to
provide
1. The A3P030 does not support PLL or SRAM.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A3P1000-1FG144 | 功能描述:IC FPGA 1KB FLASH 1M 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A3P1000-1FG144ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P1000-1FG144I | 功能描述:IC FPGA 1KB FLASH 1M 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
| A3P1000-1FG144M | 制造商:Microsemi Corporation 功能描述:FPGA ProASIC?3 Family 1M Gates 130nm Technology 1.5V 144-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3 FAMILY 1M GATES 130NM (CMOS) TECHNOLOGY 1.5V - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA PROASIC?3 FAMILY 1M GATES 130NM (CMOS) TECHNOLOGY 1.5V - Trays |
| A3P1000-1FG144PP | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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