![](http://datasheet.mmic.net.cn/50000/97-AQ132C-P_datasheet_1934842/97-AQ132C-P_1.png)
Part No. 97-AQ132C - 132 Pin
PQFP to Amp Socket PGA Footprint
Note: Aries specializes in custom design and production. In addition to the stan-
dard products shown on this page, special materials, platings, sizes, and configura-
tions can be furnished, depending on quantities. Aries reserves the right to change
product specifications without notice.
FEATURES:
Convert surface mount PQFP packages to an Amp
interstitial PGA footprint.
Reduce costs by using less expensive PQFP packages to
replace PGA footprints in existing designs.
Pins are mechanically fastened and soldered to board
using Aries patented process, creating a reliable
electrical connection and rugged contact.
Consult factory for panelized form or for mounting of
consigned chips.
SPECIFICATIONS:
Body material is black FR-4, .062 [1.58] thick, with
1 ounce minimum Copper traces.
Pads are bare Copper protected with Entekby Enthone
to eliminate coplanarity concerns and solder bridges
associated with hot air solder leveling.
Pin is Brass Alloy 360, 1/2 hard per QQ-B-626.
Pin plating is 200 [5.08m] min. Tin per MIL-T-10727
over 100 [2.54m] min. Nickel per QQ-N-290.
Operating temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.028 ± .003 [.71 ± .08] dia.
Will plug into existing PGA footprint with matching pad
assignments.
ALL DIMENSIONS: INCHES [MILLIMETERS]
18022
REV.A
PANELIZED FORM
(42 per Panel)
ORDERING INFORMATION
Tolerances:
Row-to-row: ± .003 [.08]
Pin-to-pin: ± .003 [.08]
non-cumulative
All others: ± .005 [.08] unless
otherwise specified
Specify Part No. 97-AQ132C
-or-
97-AQ132C-P for panelized form
when ordering
NORTH AMERICA
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX: (908) 996-3891
UK/SCANDINAVIA/IRELAND
Milton Keynes, GB
TEL: +44 1908 260007
FAX: +44 1908 260008
EUROPE (MAINLAND)
Papendrecht, Holland
TEL: +31 78 615 94 65
FAX: +31 78 615 43 11
http://www.arieselec.com info@arieselec.com