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參數(shù)資料
| 型號： | 97-AQ132D-P |
| 廠商： | ARIES ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | PQFP132-PGA132, IC SOCKET |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 792K |
| 代理商： | 97-AQ132D-P |
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Convert surface-mount PQFP packages to an Amp interstitial PGA footprint.
Reduce costs by using less-expensive PQFP packages to replace PGA footprints in
existing designs.
Pins are mechanically fastened and soldered to board using Aries patented process,
creating a reliable electrical connection and rugged contact.
Consult factory for Panelized Form or for mounting of consigned chips.
GENERAL SPECIFICATIONS
BODY MATERIAL: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces
PADS: bare Cu protected with ENIG (Immersion Au over Electroless Ni) to
eliminate coplanarity concerns and solder bridges associated with hot air solder
leveling
PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100 [2.54] Ni per SAE
AMS-QQ-N-290
OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Will plug into existing PGA footprint with matching Pad assignments
18022
Rev. AA
P/N 97-AQ132D 132-Pin Amp Footprint
PQFP-to-PGA Socket
ORDERING INFORMATION
Specify...
P/N 97-AQ132D or
P/N 97-AQ132D-P for Panelized form
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE: Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW AND PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
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