
Philips Semiconductors
Product data
MAX708R/S/T
3 V microprocessor supervisor circuit with
power fail comparator and manual reset
2002 Feb 13
3
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
TEMPERATURE
TYPE NUMBER
NAME
DESCRIPTION
RANGE
MAX708xD
SO8
plastic small outline package; 8 leads (see dimensional drawing)
–45
°C to +85 °C
NOTE:
The device has 3 voltage output options, indicated by the ‘x’ on the
‘Type number’.
Part number
Threshold Voltage (Typical)
MAX708RD
2.63 V
MAX708SD
2.93 V
MAX708TD
3.08 V
PIN CONFIGURATION
SL01639
1
2
3
4
8
7
6
5
TOP VIEW
SO8
MR
VCC
GND
PFI
RESET
NC
PFO
Figure 2. Pin configuration.
PIN DESCRIPTION
PIN
SYMBOL
DESCRIPTION
1
MR
Manual reset input (Active-LOW). Triggers a
reset pulse when pulled below 0.6 V. Connect
to VCC or leave floating if not used.
2
VCC
Supply voltage input.
3
GND
Ground.
4
PFI
Power fail comparator input. When PFI is less
than 1.25 V, PFO goes LOW, otherwise PFO
remains HIGH. Connect to ground if not used.
5
PFO
Power fail comparator output (Active-LOW).
When voltage at PFI is less than 1.25 V, PFO
goes LOW and sinks current. Do not connect
if not used.
6
NC
No connection.
7
RESET
Active-LOW reset output. RESET is LOW if
VCC is below the threshold voltage or if MR is
held LOW. RESET is maintained for 200 ms
after the reset conditions are terminated.
8
RESET
Active-HIGH reset output. RESET is HIGH if
VCC is below the threshold voltage or if MR is
held LOW. RESET is maintained for 200 ms
after the reset conditions are terminated.
MAXIMUM RATINGS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
Supply voltage
–0.3
6.0
V
Vn
Other input pin voltage
Note 1
–0.3
VCC + 0.3
V
Input current at VCC or GND
–
20
mA
Output current, all outputs
–
20
mA
Rate of rise at VCC
–
100
V/
s
Tamb
Ambient temperature
–40
+85
°C
Tstg
Storage temperature
–65
+160
°C
P
Power dissipation, SO8 package
Tamb = 70 °C; Note 2
–
470
mW
NOTES:
1. Input voltage limits on PFI and MR can be exceeded provided the input current is less than 10 mA.
2. Derate the dissipation 5.88 mW/
°C above 70 °C.