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參數資料
| 型號： | 935267050025 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數： | 2/23頁 |
| 文件大?。?/td> | 331K |
| 代理商： | 935267050025 |
January 2005
Page 10 of 23
Public
6 Mechanical Die Specifications
Designation:
VCOL1V0
visible on each die
location see attached die plan
Bond pad location:
see attached die plan
Bond pad size:
LA, LB
130 m x 150 m
Test pad size:
TEST, VSS
90 m x 90 m (the test pads are electrically neutral
at sawn wafers)
Bond pad metallisation material:
AlSiCu
Metallisation thickness:
1.4 m
Die dimensions (incl. 80 m scribe line):
1460 m x 1490 m
Die dimensions (excl. scribe line):
1380 m x 1410 m
Tolerances for sawn dies:
± 25 m
Pin identification:
see attached die plan
Passivation attributes:
The passivation is a protection of active areas against dust (particles) and humidity and general
contamination (whole surface of the chip except for the bond pads).
Top side passivation material:
Oxynitride
Passivation thickness:
1.6 m
Due to the glass-like physical properties careful handling and processing is required.
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