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參數(shù)資料
| 型號(hào)： | 935267010117 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號(hào)調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, CQCC24 |
| 封裝： | LCC-24 |
| 文件頁(yè)數(shù)： | 7/17頁(yè) |
| 文件大?。?/td> | 476K |
| 代理商： | 935267010117 |
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2000 January
15
Philips Semiconductors
Objective specification
Frame Transfer CCD Image Sensor
FXA 1012
Package information
Figure 11 - Mechanical drawing of the FXA 1012 package
1. The bottom of the package [A] is the height reference.
2. The height from the bottom [A] to the effective image area is 1.685 +/-0.168mm.
The height from the top of the cover glass [B] to the effective image area is 1.865 +/-0.2mm.
3. The tilt of the effective image area relative to the height reference is less than 0.095mm.
4. The thickness of the Au plating is more than 1.0um.
The thickness of the Au plating is less than 3.0um.
5. The point [C] is the origin of H&V direction.
6. The center of effective image area relative to [C] is (V,H)=(8.605,0)+/-0.2mm.
7. The rotation angle of the effective image area relative to H and V is less than +/-1.5 degrees.
8. The rotation angle of the cover glass relative to H and V is less than +/-2degrees.
9. The thickness of the cover glass is 1.5 +/-0.05mm, and the refractive index 1.5.
10. The refractive index of the resin is 1.5.
11. The tolerances that are not shown are +/-0.13mm.
12. D=2.18 +/-0.44mm
D: Distance between left edge of imaging area and left edge of cover glass.
+/-0.44mm means 4sgm = 0.44mm.
13. No horizontal force is allowed to cover glass lid.
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS
Optical center
a-a'
Resin
Sensor
H
V
Glass
c
A
B
a
R0.25
1.
2
+
/
-
0.
15
0.
7
+
/
-
0.
08
4-R0.3
1. 685 +/ - 0. 168
1+
/
-
0
.
1
12. 7 +/ - 0. 1
2. 54
2. 05 +/ - 0. 14
3. 55 +/ - 0. 2
(R0.6)
8. 3 +/ - 0. 2
R0.5
16.
3
+
/
-
0.
2
2.
9
+
/
-
0.
4
8.
60
5
+
/
-
0.
2
0.
3
+
/
-
0.
13
1
(1. 2)
1.
2
1. 2
1. 865 +/ - 0. 2
a'
14.
1
+
/
-
0.
4
6. 3 +/ - 0. 4
6. 4 +/ - 0. 4
2- 1
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