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| 型號(hào)： | 935264466005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁(yè)數(shù)： | 7/23頁(yè) |
| 文件大?。?/td> | 337K |
| 代理商： | 935264466005 |
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ICODE1 Chip Specification
Rev. 2.2
January 2005
SL040522.doc/B
Public
Page 15 of 23
11 Handling Recommendations
Please refer to Philips ‘General Specification for 6” Wafer (Prod. Spec.)’ for the following items:
11.1 Die Attach
11.2 Wire Bonding
12 Coil Specification
The ICODE1 Label IC has to be connected at pads LA, LB to a coil characterised by its electrical
parameters according to Philips application note ‘SL1 ICS30 01 ICODE1 Label IC, Coil Design
Guide’.
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