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參數(shù)資料
| 型號： | 935264466005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 4/23頁 |
| 文件大?。?/td> | 337K |
| 代理商： | 935264466005 |
ICODE1 Chip Specification
Rev. 2.2
January 2005
SL040522.doc/B
Public
Page 12 of 23
8 Documentation
8.1 Delivery Documentation
Each wafer container and each larger shipment container is individually marked with the
identification information as follows:
Diffusion Batch number (wafer lot number)
Part designation (type) with revision number
Ordering code (see chapter 4)
Date code of lot acceptation
Good die quantity
The print out of the final test results is attached to the packing and contains the good die quantity
related to every wafer number.
8.2 Fail-Die Identification
Every die is electrically tested according to data sheet. Identification of chips with electrical
parameters not conform with the data sheet is done by inking and wafer mapping (all dies at wafer
periphery are identified as 'FAIL').
8.2.1 Ink Dot Specification
Diameter:
min. 0.4 mm
Height:
max. 20 m
Colour:
black
Position:
central third of die (x, y direction)
Attributes:
opaque, water resistant
NOTE: Uncompleted dies with an area < 95 % (wafer periphery) are not inked!
8.2.2 Wafer Mapping
Wafer mapping for failed die identification is available on Floppy-Disk.
Format:
IBIS format on 3.5
″ Floppy-Disk
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