參數(shù)資料
型號: 79RC32H435-350BCI
廠商: Integrated Device Technology, Inc.
英文描述: IDTTM InterpriseTM Integrated Communications Processor
中文描述: IDTTM InterpriseTM集成通信處理器
文件頁數(shù): 36/53頁
文件大?。?/td> 444K
代理商: 79RC32H435-350BCI
36 of 53
January 19, 2006
IDT 79RC32435
Power-on S equenc e
Three power-on sequences are given below Sequence #1 is recommended because it will prevent I/O conflicts and will also allow the input signals
to propagate when the I/O powers are brought up.
Note:
The ESD diodes may be damaged if one of the voltages is applied and one of the other voltages is at a ground level.
A
. Recommended Sequence
t2 > 0 whenever possible (V
cc
Core)
t1 - t2 can be 0 (V
cc
SI/O followed by V
cc
I/O)
B
. Reverse Voltage Sequence
If sequence A is not feasible, then Sequence B can be used:
t1 <50ms and t2 <50ms to prevent damage.
C
. Simultaneous Power-up
VccI/O, VccSI/O, and VccCore can be powered up simultaneously.
1.2V
cc
3.3V
2.5V
V
cc
Time
t1
t2
I/O
VccI/O -- 3.3V
VccSI/O -- 2.5V
VccCore -- 1.2V
Vcc1.2
Vcc3.3
Vcc2.5
Time
t1
t2
VccI/O -- 3.3V
VccSI/O -- 2.5V
VccCore -- 1.2V
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79RC32H435-400BC 功能描述:處理器 - 專門應(yīng)用 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
79RC32H435-400BCG 功能描述:處理器 - 專門應(yīng)用 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
79RC32H435-400BCI 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:IDTTM InterpriseTM Integrated Communications Processor
79RC32K438200BB 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:IDTTM InterpriseTM Integrated Communications Processor
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