參數(shù)資料
型號： 79RC32H435-300BC
廠商： Integrated Device Technology, Inc.
英文描述： IDTTM InterpriseTM Integrated Communications Processor
中文描述： IDTTM InterpriseTM集成通信處理器
文件頁數(shù)： 19/53頁
文件大小： 444K
代理商： 79RC32H435-300BC
19 of 53
January 19, 2006
IDT 79RC32435
Figure 5 Externally Initiated Warm Reset AC Timing Waveform
S ignal
S ymbol
Referenc e
Edge
266MHz
300MHz
350MHz
400MHz
Unit
T iming
Diagram
Referenc e
Mn
Max
Mn
Max
Min
Max
Mn
Max
Memory Bus - DDR Access
DDRDATA[15:0]
Tskew_7g
DDRDQSx
0
0.9
0
0.8
1
1.
Meets DDR timng requirements for 150MHz clock rate DDR SDRAMs with 300 ps remaining margin to compensate for PCB propagation msmatches, which is adequate to
guarantee functional timng, provided the RC32435 DDR layout guidelines are adhered to.
2.
Setup times are calculated as applicable clock period - Tdo max. For example, if the DDR is running at 266MHz, it uses a 133MHz input clock. The period for a 133MHz clock
is 7.5ns. If the Tdo max value is 4.6ns, the T
IS
parameter is 7.5ns mnus 4.6ns = 2.9ns. The DDR spec for this parameter is 1ns, so there is 1.9ns of slack left over for board
propagation. Calculations for T
DS
are simlar, but since this parameter is taken relative to the DDRDQS signals, which are referenced on both edges, the effective period with
a 133MHz input clock is only 3.75ns. So, if the max Tdo is 1.9ns, we have 3.75ns mnus 1.9ns = 1.85ns for T
DS
. The DDR data sheet specs a value of 0.5ns for 266MHz, so
this leaves 1.35ns slack for board propagation delays.
0
0.7
0.0
0.6
ns
See Figures 6
and 7.
Tdo_7k
2
1.2
1.9
1.0
1.7
0.7
1.5
0.5
1.4
ns
DDRDM[1:0]
Tdo_7l
DDRDQSx
1.2
1.9
1.0
1.7
0.7
1.5
0.5
1.4
ns
DDRDQS[1:0]
Tdo_7i
DDRCKP
-0.75
0.75
-0.75
0.75
-0.7
0.7
-0.7
0.7
ns
DDRADDR[13:0],
DDRBA[1:0],
DDRCASN,
DDRCKE,
DDRCSN,
DDRRASN,
DDRWEN
Tdo_7m
DDRCKP
1.0
4.0
1.0
4.3
1.0
4.0
1.0
4.0
ns
Table 7 DDR SDRAMTiming Characteristics
1.
Warmreset condition caused by assertion of RSTN by an external agent.
2.
The RC32435 tri-states the data bus, MDATA[7:0], negates all memory control signals, and itself asserts RSTN. The RC32435 continues to
drive the address bus throughout the entire warmreset.
3.
The RC32435 negates RSTN after 4000 master clock (CLK) clock cycles.
4.
External logic negates RSTN.
5.
The RC32435 samples RSTN negated at least 4000 master clock (CLK) clock cycles after step 3 and starts driving the data bus,
MDATA[7:0].
6.
CPU begins executing by taking a MIPS soft reset exception. The assertion of CSN[0] will occur no sooner than 16 clock cycles after the
RC32435 samples RSTN negated (i.e., step 5).
Active
Deasserted
Active
CLK
COLDRSTN
RSTN
MDATA[7:0]
MemControl Signals
FFFF_FFFF
1
2
4
5
6
3
≥
4000 CLK
clock Cycles
≥
4000 CLK
clock Cycles
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
79RC32H435-300BCG 功能描述:處理器 - 專門應(yīng)用 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
79RC32H435-300BCGI 功能描述:處理器 - 專門應(yīng)用 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
79RC32H435-300BCI 功能描述:處理器 - 專門應(yīng)用 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
79RC32H435-350BC 功能描述:處理器 - 專門應(yīng)用 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
79RC32H435-350BCG 功能描述:處理器 - 專門應(yīng)用 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
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