Data Sheet U14121EJ2V0DS00
91
μ
PD784214A, 784215A, 784216A, 784217A, 784218A, 784214AY, 784215AY, 784216AY, 784217AY, 784218AY
Table 15-1. Surface Mounting Type Soldering Conditions (2/2)
(2)
μ
PD784214AGF-
μ
PD784215AGF-
μ
PD784216AGF-
μ
PD784217AGF-
μ
PD784218AGF-
μ
PD784214AYGF-
μ
PD784215AYGF-
μ
PD784216AYGF-
μ
PD784217AYGF-
μ
PD784218AYGF-
×××
-3BA:100-pin plastic QFP(14
×
20 mm)
×××
-3BA:100-pin plastic QFP(14
×
20 mm)
×××
-3BA:100-pin plastic QFP(14
×
20 mm)
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
×××
-3BA:100-pin plastic QFP(14
×
20 mm)
×××
-3BA:100-pin plastic QFP(14
×
20 mm)
×××
-3BA:100-pin plastic QFP(14
×
20 mm)
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Caution Do not use different soldering methods together (except for partial heating).
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