參數(shù)資料
型號： 7814J-1-023E
英文描述： DREHSCHALTER SMD 4MM 5ST
中文描述： DREHSCHALTER貼片毫米5ST
文件頁數(shù)： 37/37頁
文件大?。?/td> 1915K
代理商： 7814J-1-023E
Specifications are subject to change without notice.
375
SDH Series SMD DIP Switch Half Pitch
Features
I
Double contact offers high reliability
I
Vapor phase and Infra-red solderable
I
Terminal plating by gold gives excellent
results when soldering
I
Just 2.3mm total height
I
Half pitch of 1.27mm(.050 in.)
Applications
I
Interface boards from PC to modems,
printers, plotters, instruments for IBM
I
PC/XT/AT and compatibles
I
Portable data logging systems
I
Auto dialing & alarm monitoring systems
I
I/O modules, signal conditioners
I
Converters (communication)
How to Order
SDH R - 8 - T R
Model
Actuator
R = Recessed
Number of positions
8 = 8 positions
Seal
T = Top tap sealed
Packaging
R = Tape and reel
DIMENSIONS ARE:
METRIC
(INCHES)
TOLERANCES: ±.2 EXCEPT WHERE NOTED.
Electrical Characteristics
Electrical Life ......1,000 operation cycles
per switch min.
Non-Switching Rating ....100mA, 50VDC
Switching Rating ..............25mA, 24VDC
Contact Resistance......100mohms max.
Insulation Resistance ..100Mohms min.,
DC 100V min.
Dielectric StrengthAC 300V for 1 minute
Capacitance.............................5pF max.
between adjacent closed switch
Circuit ...............Single pole single throw
Environmental Characteristics
Mechanical Life............2,000 operations
per switch min.
Operation Force .....................500g max.
Stroke...........................................0.6mm
Operating Temp. Range.-30°C to +85°C
Storage Temperature .....-40°C to +85°C
Vibration Test .................MIL-STD-202F,
Method 201A
Frequency.........10-50-10 Hz/1 minute
Directions............X,Y,Z, three mutually
perpendicular directions
Time.................2 hours each direction,
high reliability
Shock Test .....................MIL-STD-202F,
Method 213B, Condition A
Gravity .......50G (peak value), 11 msec
Direction & Times ..............6 sides and
3 times in each direction.
High reliability
Physical Characteristics
Cover Materials................Thermoplastic
Nylon, UL94V-0; black
Base Materials..................Thermoplastic
Nylon, UL94V-0; black
Actuator Materials............Thermoplastic
Nylon, UL94V-0; white
Contact Materials...............Alloy Copper
Contact Plating........3 Micro inches gold
over 40 micro inches nickel
Terminal Materials..................Brass with
Gold plating
Reflow Soldering .......Peak temperature
or reflow oven should
be set to 240° C. max.
2 sec. while applying solder
Cleaning Process .................Freon TF or
trichlormethane by ultrasonic
wave washing for 2 minutes
Packaging........................All poles in the
“off” position
1
2
3
4
5
6
7
8
ON
A
0.40
(.016)
B
SDHR
0.60
(.023)
5.40
(.212)
STROKE
1.43
(.056)
(1.27
2.30 +0.10/- 0
(.090 +0.004/-0)
0.10
±
0.10
(.004
±
.004)
0.60
±
0.20
(.024
±
.008)
8.0
±
0.30
(.315
±
.012)
5.00
(.197)
B
±
0.10 = 1.27 x (P-1)
(B
±
.004 = .050 x (P-1)
6.35
(.250)
7.62
(.300)
8.89
(.350)
1.27
(.050)
0.76
(.030)
RECOMMENDED PCB LAYOUT
CIRCUIT DIAGRAM
T
max. 120
250
°
C
150
°
C
Max.
240
°
C230
°
C
150
°
C
Room Temp.
max. 20
REFLOW TEMPERATURE PROFILE
TIME (sec.)
DIMENSION A
DIMENSION B
11.56
(0.455)
8.89
(0.350)
Product Dimensions
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