參數(shù)資料
型號： 7814J-1-023E
英文描述： DREHSCHALTER SMD 4MM 5ST
中文描述： DREHSCHALTER貼片毫米5ST
文件頁數(shù)： 33/37頁
文件大小： 1915K
代理商： 7814J-1-023E
Specifications are subject to change without notice.
371
SDS/SDP/SDA Series Slide DIP Switch
Features
I
Normal open contact system
I
Low contact resistance
I
High reliability
I
Self-clean on contact area
Applications
I
PC interface boards
I
LANs
I
Auto dialing systems
I
Remote controlled systems
Electrical Characteristics
Electrical Life ............2,000 operations min.
per switch, 24VDC, 25mA
Non-Switching Rating ........100mA, 50VDC
Switching Rating ..................25mA, 24 VDC
Contact Resistance (@ current 100mA)
........................50 milliohms max. at initial
100 milliohms max. after life test
Insulation Resistance
at 500VDC ±15V............100 megohms min.
between adjacent terminals
Dielectric Strength..............500VDC/minute
Capacitance ..................5pF max. between
adjacent terminals
Circuit ....................Single pole single throw
Environmental Characteristics
Mechanical Life..2,000 operations per switch
Operation Force..........................800g max.
Stroke................................................2.0mm
Operating Temp. Range......-40°C to +85°C
Storage Temperature..........-40°C to +85°C
Vibration Test......................MIL-STD-202F,
Method 201A
Frequency ..............10-55-10 Hz/1 minute
Directions ................X,Y,Z, three mutually
perpendicular directions
Time......................2 hours each direction.
High reliability
Shock Test ..........................MIL-STD-202F,
Method 213B, Condition A
Gravity ............50G (peak value), 11 msec
Direction & Times....................6 sides and
3 times in each direction.
High reliability
Physical Characteristics
Base and Cover Materials
..UL94V-0 PBT plus glass fiber reinforced
Color ......................Black base, red cover
Actuator Materials..................UL94V-0 PBT
plus glass fiber reinforced
Color ................................................White
Contact Materials ....Phosphor bronze with
3 micro inches gold plating over nickel
Top Seal Materials..................Polyester film
Potting Materials................................Epoxy
Wave Soldering Process*
......Recommended solder temp. at 260°C
(500°F) max., 5 sec.
Hand Soldering Process*
................Use a soldering iron of 30 watts
or less, controlled at 320°C (608°F) for
approx. 2 sec. while applying solder
Cleaning Process*
..............Flux clean using force rinse, high
agitation or triple bath cleaning method.
Freon TF or TE give excellent results.
When vapor methods are used, do not
subject the switch to solvents at
temperatures above 51°C (125°F).
Standard Packaging
......IC tubes/all poles in the “off” position
*For best results, keep all switch contacts in their “off”
position for all operations.
RECOMMENDED PCB LAYOUT
B
±
0.10 = 2.54 x (P-1)
(B
±
.004 = .100 x (P-1))
7.62
±
0.10
(.300
±
.004)
0.97
±
.002) DIA.
(.038
±
SCHEMATIC (TYP.)
2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE
SDS Series
A +.0.20/ -0
(A + .008/-0)
3.50
(.138)
9.90 + 0.20/-0
(.390 + .008/-0)
1
DIP
2
3
4
5
6
7
8
ON
6.90
3.20
(.126) MIN.
1.0
(.039)
1.40
(.055)
1.95
(.077)
0.60
(.024)
1.60
(.063)
0.15
(.006)
B
2.54
(.100) TYP.
7.62
±
0.50
(.300
±
.020)
SDSX SERIES
SDSR SERIES
10.20
C
2.05
(.081)
B
RECOMMENDED PCB LAYOUT
SCHEMATIC (TYP.)
2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE
SDP Series
10.8
(.425)
1
2
3
4
5
6
7
8
DIP
ON
0.60
(.024)
1.30
(.051)
1.84
(.072)
SDPR SERIES
SDPX SERIES
12.57
(.495)
30
°
B
±
0.10 = 2.54 x (P-1)
(B
±
.004 = .100 x (P-1))
7.62
±
0.10
(.300
±
.004)
0.97
±
.002) DIA.
(.038
±
A +.0.20/ -0
(A + .008/-0)
3.20
0.15
(.006)
2.54
(.100) TYP.
7.62
±
0.50
(.300
±
.020)
SEE FOLLOWING PAGE FOR A & B DIMENSION CHART.
SEE FOLLOWING PAGE FOR A & B DIMENSION CHART.
Product Dimensions
DIMENSIONS: (IN)
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