參數(shù)資料
型號(hào): 74LV393PW,112
廠商: NXP Semiconductors
文件頁(yè)數(shù): 4/12頁(yè)
文件大?。?/td> 0K
描述: IC DUAL 4BIT BINAR RIPPL 14TSSOP
產(chǎn)品培訓(xùn)模塊: Logic Packages
標(biāo)準(zhǔn)包裝: 96
系列: 74LV
邏輯類型: 二進(jìn)制計(jì)數(shù)器
方向:
元件數(shù): 2
每個(gè)元件的位元數(shù): 4
復(fù)位: 異步
計(jì)數(shù)速率: 20MHz
觸發(fā)器類型: 負(fù)邊沿
電源電壓: 1 V ~ 3.6 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 管件
產(chǎn)品目錄頁(yè)面: 838 (CN2011-ZH PDF)
其它名稱: 568-2968-5
935198250112
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX573
Lo
w
V
olta
g
e
Octal
Latc
h
with
5V
T
olerant
Inputs
and
Outputs
Physical Dimensions (Continued)
Figure 6. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specications do not expand the terms of Fairchild’s worldwide terms and conditions,
specically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
74LCX573 Rev. 1.6.1
12
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