- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄358652 > 74HC297D-T Analog Phase-Locked Loop PDF資料下載
參數(shù)資料
| 型號(hào)： | 74HC297D-T |
| 英文描述： | Analog Phase-Locked Loop |
| 中文描述： | 模擬鎖相環(huán) |
| 文件頁(yè)數(shù)： | 14/16頁(yè) |
| 文件大?。?/td> | 83K |
| 代理商： | 74HC297D-T |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)當(dāng)前第14頁(yè)第15頁(yè)第16頁(yè)
2003 May 14
14
Philips Semiconductors
Product specification
Dual 2-input NOR gate
74HC2G02; 74HCT2G02
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 74HC283D-T | Binary Adder |
| 74HC280D-T | SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits |
| 74HC27D-T | Triple 3-input NOR Gate |
| 74HC273D-T | SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits |
| 74HC259D-T | SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74HC298 | 制造商:HITACHI 制造商全稱:Hitachi Semiconductor 功能描述:Quad. 2-input Multiplexers (with storage) |
| 74HC299 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit universal shift register; 3-state |
| 74HC299D | 功能描述:計(jì)數(shù)器移位寄存器 8-BIT UNIVERSAL SHFT REG 3-S RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
| 74HC299D,652 | 功能描述:計(jì)數(shù)器移位寄存器 8-BIT UNIVERSAL SHFT RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
| 74HC299D,653 | 功能描述:計(jì)數(shù)器移位寄存器 8-BIT UNIVERSAL SHFT REG 3-S RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。