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參數(shù)資料
| 型號(hào)： | 74ALVCH16543DGG:11 |
| 廠(chǎng)商： | NXP Semiconductors |
| 文件頁(yè)數(shù)： | 8/20頁(yè) |
| 文件大小： | 0K |
| 描述： | IC TRANSCVR TRI-ST 16BIT 56SSOP |
| 產(chǎn)品培訓(xùn)模塊： | Logic Packages |
| 標(biāo)準(zhǔn)包裝： | 35 |
| 系列： | 74ALVCH |
| 邏輯類(lèi)型： | 寄存收發(fā)器，非反相 |
| 元件數(shù)： | 2 |
| 每個(gè)元件的位元數(shù)： | 8 |
| 輸出電流高，低： | 24mA，24mA |
| 電源電壓： | 1.2 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 56-TFSOP（0.240"，6.10mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 56-TSSOP |
| 包裝： | 管件 |
| 其它名稱(chēng)： | 74ALVCH16543DG 74ALVCH16543DG-ND 935262544112 |
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1999 Nov 23
16
Philips Semiconductors
Product specication
16-bit D-type registered transceiver; 3-state
74ALVCH16543
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
Data sheet status
Objective specication
This data sheet contains target or goal specications for product development.
Preliminary specication
This data sheet contains preliminary data; supplementary data may be published later.
Product specication
This data sheet contains nal product specications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specication
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specication.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74ALVCH16543DGGRE4 | 功能描述:總線(xiàn)收發(fā)器 16B Reg Trnscvr RoHS:否 制造商:Fairchild Semiconductor 邏輯類(lèi)型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類(lèi)型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| 74ALVCH16543DGGRG4 | 功能描述:總線(xiàn)收發(fā)器 16B Reg Xceiver RoHS:否 制造商:Fairchild Semiconductor 邏輯類(lèi)型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類(lèi)型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| 74ALVCH16543DGGS | 功能描述:IC TXRX 16BIT TRI-ST 56TSSOP 制造商:nexperia usa inc. 系列:74ALVCH 包裝:管件 零件狀態(tài):在售 邏輯類(lèi)型:收發(fā)器，非反相 元件數(shù):2 每元件位數(shù):8 輸入類(lèi)型:- 輸出類(lèi)型:推挽式 電流 - 輸出高，低:24mA，24mA 電壓 - 電源:1.2 V ~ 3.6 V 工作溫度:-40°C ~ 85°C（TA） 安裝類(lèi)型:表面貼裝 封裝/外殼:56-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商器件封裝:56-TSSOP 標(biāo)準(zhǔn)包裝:35 |
| 74ALVCH16543DGGY | 功能描述:Transceiver, Non-Inverting 2 Element 8 Bit per Element Push-Pull Output 56-TSSOP 制造商:nxp semiconductors 系列:74ALVCH 包裝:帶卷（TR） 零件狀態(tài):有效 邏輯類(lèi)型:收發(fā)器，非反相 元件數(shù):2 每元件位數(shù):8 輸入類(lèi)型:- 輸出類(lèi)型:推挽式 電流 - 輸出高，低:24mA，24mA 電壓 - 電源:1.2 V ~ 3.6 V 工作溫度:-40°C ~ 85°C（TA） 安裝類(lèi)型:表面貼裝 封裝/外殼:56-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商器件封裝:56-TSSOP 標(biāo)準(zhǔn)包裝:2,000 |
| 74ALVCH16543DG-T | 功能描述:總線(xiàn)收發(fā)器 16-BIT LATCH XCVR 3-S RoHS:否 制造商:Fairchild Semiconductor 邏輯類(lèi)型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類(lèi)型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
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