參數(shù)資料
型號(hào): 5962D0153301QXX
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, QMA68
封裝: DUAL CAVITY, CERAMIC, QFP-68
文件頁數(shù): 9/14頁
文件大?。?/td> 124K
代理商: 5962D0153301QXX
4
ABSOLUTE MAXIMUM RATINGS1
(Referenced to V
SS)
Notes:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability and performance.
2. Maximum junction temperature may be increased to +175
°C during burn-in and steady-static life.
3. Test per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
VDD
DC supply voltage
-0.5 to 4.6V
V
I/O
Voltage on any pin
-0.5 to 4.6V
TSTG
Storage temperature
-65 to +150
°C
PD
Maximum power dissipation
1.0W (per byte)
T
J
Maximum junction temperature2
+150
°C
Θ
JC
Thermal resistance, junction-to-case
3
10
°C/W
II
DC input current
±10 mA
SYMBOL
PARAMETER
LIMITS
VDD
Positive supply voltage
3.0 to 3.6V
T
C
Case temperature range
-40 to +125
°C
VIN
DC input voltage
0V to VDD
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