參數(shù)資料
型號： 508700B00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 2/116頁
文件大?。?/td> 0K
描述： HEATSINK 40-PIN DIP GLUE-ON BLK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
產(chǎn)品目錄繪圖： 508700B00000G
標準包裝： 1,080
類型： 頂部安裝
冷卻式包裝： 40-DIP
固定方法： 散熱帶，粘合劑（不含）
形狀： 矩形
長度： 2.000"（50.80mm）
寬： 0.530"（13.46mm）
機座外的高度（散熱片高度）： 0.190"（4.83mm）
溫升時的功耗： 1W @ 30°C
在強制氣流下的熱敏電阻： 在 300 LFM 時為16°C/W
自然環(huán)境下的熱電阻： 27.2°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 508700B00000
6087B
HS274
10
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Find a heat sink to keep a TO-220 device below the maximum
150 °C junction temperature in forced convection at 400 ft/min.
Device must be electrically insulated and mounted with a labor
saving clip.
Given:
PD = 12 watts
RθJC = 2.5°C/W (from semiconductor manufacturer)
TJ max = 140°C (from semiconductor manufacturer)
TA max = 50°C
A Hi-Flow pad works great with clip mounting and provides the
necessary electrical insulation. Thermal resistance for
Hi-Flow at low pressure is 1.15°C/W (from page 87).
Using equation 1, solve for RθSA
RθSA = 140 – 50 - (2.5 + 1.15) = 3.85°C/W
12
Many styles are available. If board space is a concern,
533202B02551G (pg 55) meets the requirements.
According to the above graph, an airflow of 400 ft/min results
in a thermal resistance of 3°C/W. This is less than the required
thermal resistance of 3.85°C/W and is therefore acceptable
under these airflow conditions.
If height is a concern, 533702B02552G would meet the
requirements and is only 1.0” tall
Find a space saving heat sink to keep a TO-220 device below the
maximum 150°C junction temperature in natural convection. Device
will be screw mounted with an electrically conductive interface.
Given:
PD = 6 watts
RθJC = 3°C/W (from semiconductor manufacturer)
TJ max = 150°C (from semiconductor manufacturer)
TA max = 65°C
A KonduxTM pad is a good choice for electrically conductive
applications. Thermal resistance for KonduxTM can be determined
from the following graph.
Example B
Example A
Typical TO-220 Performance
Screw Torque (in-lb)
0.00
012
3
4
5
R
(C/W
)
CS
0.10
0.20
0.30
0.40
0.50
0.60
6
How To Select a Heat Sink
At 2 in-lb of torque the thermal resistance
is approximately RθCS = 0.5°C/W
Using equation 1, solve for RθSA
RθSA = 150 – 65 - ( 3 + 0.5) = 10.7°C/W
6
The Index by Heat Sink Style on page 8 lists space saving heat sinks.
Several models are in the 10 °C/W range. Choose the one that best
fits the application and verify thermal resistance from graph.
Part number 593202B03500G shows
a 60 °C temperature rise at 6 watts.
RθSA = 60 = 10.0°C/W
6
Which meets the above requirement in natural convection.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
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Moun
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Ri
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t—°C
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
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Resistanc
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t—°C/W
at
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53330X
53320X
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t—°C
Hi-Flow is a trademark of the Bergquist Company
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