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參數(shù)資料
| 型號： | 505892X |
| 英文描述： | Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits |
| 中文描述： | 集成電路 |
| 文件頁數(shù)： | 10/16頁 |
| 文件大?。?/td> | 278K |
| 代理商： | 505892X |
10
LT1083/LT1084/LT1085
APPLICATIO
S I
N
FOR
ATIO
U
Connected as shown, R
P
is not multiplied by the divider
ratio. R
P
is about 0.004
per foot using 16-gauge wire.
This translates to 4mV/ft at 1A load current, so it is
important to keep the positive lead between regulator and
load as short as possible and use large wire or PC board
traces.
W
U
Thermal Considerations
The LT1083 series of regulators have internal power and
thermal limiting circuitry designed to protect the device
under overload conditions. For continuous normal load
conditions however, maximum junction temperature rat-
ings must not be exceeded. It is important to give careful
consideration to all sources of thermal resistance from
junction to ambient. This includes junction-to-case, case-
to-heat sink interface, and heat sink resistance itself. New
thermal resistance specifications have been developed to
more accurately reflect device temperature and ensure
safe operating temperatures. The data section for these
new regulators provides a separate thermal resistance and
maximum junction temperature for both the Control Sec-
tionand the Power Transistor Previous regulators, with a
single junction-to-case thermal resistance specification,
used an average of the two values provided here and
therefore could allow excessive junction temperatures
under certain conditions of ambient temperature and heat
sink resistance. To avoid this possibility, calculations
should be made for both sections to ensure that both
thermal limits are met.
Junction-to-case thermal resistance is specified from the
IC junction to the bottom of the case directly below the die.
This is the lowest resistance path for heat flow. Proper
mounting is required to ensure the best possible thermal
flow from this area of the package to the heat sink. Thermal
compound at the case-to-heat sink interface is strongly
recommended. If the case of the device must be electri-
cally isolated, a thermally conductive spacer can be used,
as long as its added contribution to thermal resistance is
considered. Note that the case of all devices in this series
is electrically connected to the output.
For example, using an LT1083CK (TO-3, Commercial) and
assuming:
V
IN
(max continuous) = 9V, V
OUT
= 5V, I
OUT
= 6A,
T
A
= 75
°
C,
θ
HEAT SINK
= 1
°
C/W,
θ
CASE-TO-HEAT SINK
= 0.2
°
C/W for K package with
thermal compound.
Power dissipation under these conditions is equal to:
P
D
= (V
IN
– V
OUT
)(I
OUT
) = 24W
Junction temperature will be equal to:
T
J
= T
A
+ P
D
(
θ
HEAT SINK
+
θ
CASE-TO-HEAT SINK
+
θ
JC
)
For the Control Section:
T
J
= 75
°
C + 24W (1
°
C/W + 0.2
°
C/W + 0.6
°
C/W) = 118
°
C
118
°
C < 125
°
C = T
JMAX
(Control Section
Commercial Range)
For the Power Transistor:
T
J
= 75
°
C + 24W (1
°
C/W + 0.2
°
C/W + 1.6
°
C/W) = 142
°
C
142
°
C < 150
°
C = T
JMAX
(Power Transistor
Commercial Range)
In both cases the junction temperature is below the
maximum rating for the respective sections, ensuring
reliable operation.
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