MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33981
5
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Steady-State
V
PWR
-16 to 41
V
Input/Output Terminals Voltage
(Note 1)
V
IN
-0.3 to 7.0
V
Output Voltage
V
OUT
-5.0 to 41
V
Continuous Output Current
(Note 2)
I
OUT
40
A
CSNS Input Clamp Current
I
CSNS
10
mA
SR Voltage
V
SR
-0.3 to 54
V
Temperature Feedback Voltage
V
TEMP
-0.3 to 5.0
V
C
BOOT
Voltage
C
BOOT
-0.3 to 54
V
OCLS Voltage
V
OCLS
-0.3 to 7.0
V
Low-Side Gate Voltage
V
GLS
-0.3 to 15
V
Low-Side Drain Voltage
V
DLS
-5.0 to 41
V
ESD Voltage
Human Body Model
(Note 3)
Machine Model
(Note 4)
V
ESD1
V
ESD2
±2000
±200
V
Output Clamp Energy
(Note 5)
E
CL
TBD
J
THERMAL RATINGS
Operating Temperature
Ambient
Junction
T
A
T
J
-40 to 125
-40 to 150
°C
Storage Temperature
T
STG
-55 to 150
°
C
Thermal Resistance
(Note 6)
Junction to Power Die Case
Junction to Ambient
R
θ
JC
R
θ
JA
1.0
20
°
C/W
Peak Terminal Reflow Temperature During Solder Mounting
(Note 7)
T
SOLDER
240
°C
Power Dissipation (TA = 25°C)
(Note 8)
P
D
TBD
W
Notes
1.
Exceeding voltage limits on INHS, INLS, CONF, CSNS,
FS
, TEMP, and EN
terminals may cause a malfunction or permanent damage to the
device.
Continuous high-side output rating as long as maximum junction temperature is not exceeded. Calculation of maximum output current using
package thermal resistance is required.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
)
and in accordance with the system module
specification with a capacitor > 0.01
μ
F connected from OUT to GND.
Active clamp energy using single-pulse method (L = 16 mH, R
L
= 0, V
PWR
= 12 V, T
J
= 150°C).
Device mounted on a 2s2p test board per JEDEC JESD51-2.
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Maximum power dissipation at indicated ambient temperature in free air with no heatsink used.
2.
3.
4.
5.
6.
7.
8.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.