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參數(shù)資料
| 型號(hào)： | 32TSOP |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | PACKAGE RELIABILITY REPORT |
| 中文描述： | 包裝可靠性報(bào)告 |
| 文件頁(yè)數(shù)： | 8/11頁(yè) |
| 文件大?。?/td> | 33K |
| 代理商： | 32TSOP |
MIL-STD-883-2016
MIL-STD-883-2015
MIL-STD-883-2004 : COND B2
6
6
6
0
0
0
0
PHYSICAL DIMENSIONS 9913
MARK PERMANENCY
LEAD INTEGRITY
Total:
PRECONDITIONING LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
24
240
3
125C
30C/60% R.H.
235C +5/-0C
315
315
315
STORAGE LIFE
MOISTURE SOAK
CONVECTION REFLOW
HRS
HRS
PASS
Total:
9913
0
0
TEMPERATURE CYCLE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
1000
-55C TO 125C
70
0
0
TEMP CYCLE
CYS
Total:
9913
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
100
130C, 85%R.H.,5.5V
70
0
0
HAST
HRS
Total:
9913
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
200
130C, 85% R.H.
40
0
0
HAST, NO BIAS
HRS
Total:
9913
Assembly Site:
Pin Count:
Package Type:
NSEB
28
TSOP
Body Size:
Mold Compound:
8x13.4x0.965
Ciba-Geigy Aratonic 2184-4 (KMC 184)
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Stamped Copper C7025
SnPb Plate
84-1 LMISR4 Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Assembly Information:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
Level 3
0432
0432
to
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
JESD22-B102
8
0
0
SOLDERABILITY
0432
Total:
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