The calculated failure rate for this device/process is:
The parameters used to calculate this failure rate are as follows:
Cf: 60%
Ea: 0.7
B: 0
Tu: 25
Vu: 5.5
°C
Volts
The reliability data follows. Some of the data in this report may be generic. A the start of this data is
a description of the assembly vehicle used to generate this reliability data. The next section is the
detailed reliability data for each stress. If there are additional assemblies used as part of this report,
a description of each will follow which includes the respective reliability data for that assembly.
Where appropriate, preconditioning is performed before all stresses and the bond crater test unless
otherwise noted. The reliability data section includes the latest data available.
Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate
is related to MTTF by:
MTTF = 1/Fr
NOTE: MTTF is frequently used interchangeably with MTBF.
FITS:
3.0
MTTF (YRS): 37651
FAILURE RATE:
Assembly Site:
Pin Count:
Package Type:
ASE
28
TSOP
Body Size:
Mold Compound:
8x13.4x0.965
Sumitomo G700
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Stamped Alloy 42
Sn Plate 100% Matte
Sumitomo 1076 DS
Au / 1.0 mil
UL 94-V0
Assembly Information:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
Level 3
0429
0429
to
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
JESD22-B102
15
0
0
SOLDERABILITY
0429
Total: