參數(shù)資料
型號: 25C256
廠商: Microchip Technology Inc.
英文描述: 256K 5.0V SPI Bus Serial EEPROM(4.5~5.5V,256K位,SPI總線串行EEPROM)
中文描述: 256K 5.0V SPI總線串行EEPROM(4.5?5.5V的,256K位和SPI總線串行EEPROM的)
文件頁數(shù): 160/170頁
文件大?。?/td> 4191K
代理商: 25C256
PIC16F62X
DS40300C-page 158
Preliminary
2003 Microchip Technology Inc.
K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
15
10
5
15
10
5
β
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
15
10
5
15
10
5
α
Mold Draft Angle Top
10.92
9.40
7.87
.430
.370
.310
eB
Overall Row Spacing
§
0.56
0.46
0.36
.022
.018
.014
B
Lower Lead Width
1.78
1.46
1.14
.070
.058
.045
B1
Upper Lead Width
0.38
0.29
0.20
.015
.012
.008
c
Lead Thickness
3.43
3.30
3.18
.135
.130
.125
L
Tip to Seating Plane
22.99
22.80
22.61
.905
.898
.890
D
Overall Length
6.60
6.35
6.10
.260
.250
.240
E1
Molded Package Width
8.26
7.94
7.62
.325
.313
.300
E
Shoulder to Shoulder Width
0.38
.015
A1
Base to Seating Plane
3.68
3.30
2.92
.145
.130
.115
A2
Molded Package Thickness
4.32
3.94
3.56
.170
.155
.140
A
Top to Seating Plane
2.54
.100
p
Pitch
18
18
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
1
2
D
n
E1
c
eB
β
E
α
p
A2
L
B1
B
A
A1
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
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25C320 32K 5.0V SPI Bus Serial EEPROM
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