參數(shù)資料
型號(hào): 24FC512
廠商: Microchip Technology Inc.
英文描述: 512K I2C CMOS Serial EEPROM
中文描述: 為512k的I2C的CMOS串行EEPROM
文件頁數(shù): 18/26頁
文件大?。?/td> 420K
代理商: 24FC512
24AA512/24LC512/24FC512
DS21754E-page 18
2004 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
8
4
0
8
4
0
φ
c
Foot Angle
Lead Thickness
10
5
0
10
5
0
β
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
10
5
0
10
5
0
α
Mold Draft Angle Top
0.30
0.25
0.19
.012
.010
.007
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
0.70
0.60
0.50
.028
.024
.020
L
Foot Length
5.10
5.00
4.90
.201
.197
.193
D
Molded Package Length
4.50
4.40
4.30
.177
.173
.169
E1
Molded Package Width
6.50
6.38
6.25
.256
.251
.246
E
Overall Width
0.15
0.10
0.05
.006
.004
.002
A1
Standoff
§
0.95
0.90
0.85
.037
.035
.033
A2
Molded Package Thickness
1.10
.043
A
Overall Height
0.65
.026
p
Pitch
14
14
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
L
β
c
φ
2
1
D
n
B
p
E1
E
α
A2
A1
A
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
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