參數(shù)資料
型號: 24FC512
廠商: Microchip Technology Inc.
英文描述: 512K I2C CMOS Serial EEPROM
中文描述: 為512k的I2C的CMOS串行EEPROM
文件頁數(shù): 15/26頁
文件大小: 420K
代理商: 24FC512
2004 Microchip Technology Inc.
DS21754E-page 15
24AA512/24LC512/24FC512
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units
INCHES*
NOM
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
n
p
A
A2
A1
E
E1
D
L
c
B1
B
eB
α
β
8
8
.100
.155
.130
2.54
3.94
3.30
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
.170
.145
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
4.32
3.68
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
§
5
5
5
5
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
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